AP2305AGN-HF
Halogen-Free Product
Advanced Power
Electronics Corp.
▼
Simple Drive Requirement
▼
Small Package Outline
▼
Surface Mount Device
▼
RoHS Compliant
S
SOT-23
G
D
P-CHANNEL ENHANCEMENT MODE
POWER MOSFET
BV
DSS
R
DS(ON)
I
D
-30V
80mΩ
- 3.2A
Description
D
Advanced Power MOSFETs from APEC provide the
designer with
the best combination of fast switching,
low on-resistance and cost-
effectiveness.
The SOT-23 package is widely preferred for all commercial-industrial
surface mount applications and suited for low voltage applications
such as DC/DC converters.
G
S
Absolute Maximum Ratings
Symbol
V
DS
V
GS
I
D
@T
A
=25℃
I
D
@T
A
=70℃
I
DM
P
D
@T
A
=25℃
T
STG
T
J
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
3
Continuous Drain Current
3
Pulsed Drain Current
1
Total Power Dissipation
Linear Derating Factor
Storage Temperature Range
Operating Junction Temperature Range
Rating
- 30
± 12
-3.2
-2.6
-10
1.38
0.01
-55 to 150
-55 to 150
Units
V
V
A
A
A
W
W/℃
℃
℃
Thermal Data
Symbol
Rthj-amb
Parameter
Maximum Thermal Resistance, Junction-ambient
3
Value
90
Unit
℃/W
Data and specifications subject to change without notice
1
200805212
AP2305AGN-HF
Electrical Characteristics@T
j
=25
o
C(unless otherwise specified)
Symbol
BV
DSS
ΔBV
DSS
/ΔT
j
Parameter
Drain-Source Breakdown Voltage
Static Drain-Source On-Resistance
2
Test Conditions
V
GS
=0V, I
D
=-250uA
Min.
-30
-
-
-
-
-0.5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Typ.
-
-0.1
Max. Units
-
-
60
80
150
-1.2
-
-1
-25
±100
18
-
-
-
-
-
-
1325
-
-
V
V/℃
mΩ
mΩ
mΩ
V
S
uA
uA
nA
nC
nC
nC
ns
ns
ns
ns
pF
pF
pF
Breakdown Voltage Temperature Coefficient
Reference to 25℃, I
D
=-1mA
R
DS(ON)
V
GS
=-10V, I
D
=-3.2A
V
GS
=-4.5V, I
D
=-3.0A
V
GS
=-2.5V, I
D
=-2.0A
-
-
-
-
9
-
-
-
10
1.8
3.6
7
15
21
15
735
100
80
V
GS(th)
g
fs
I
DSS
I
GSS
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
C
iss
C
oss
C
rss
Gate Threshold Voltage
Forward Transconductance
Drain-Source Leakage Current
Drain-Source Leakage Current (T
j
=70
o
C)
V
DS
=V
GS
, I
D
=-250uA
V
DS
=-5V, I
D
=-3.0A
V
DS
=-30V, V
GS
=0V
V
DS
=-24V, V
GS
=0V
V
GS
= ± 12V
I
D
=-3.2A
V
DS
=-24V
V
GS
=-4.5V
V
DS
=-15V
I
D
=-3.2A
R
G
=3.3Ω,V
GS
=-10V
R
D
=4.6Ω
V
GS
=0V
V
DS
=-25V
f=1.0MHz
Gate-Source Leakage
Total Gate Charge
2
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time
2
Rise Time
Turn-off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Source-Drain Diode
Symbol
V
SD
trr
Qrr
Parameter
Forward On Voltage
2
Reverse Recovery Time
2
Reverse Recovery Charge
Test Conditions
I
S
=-1.2A, V
GS
=0V
I
S
=-3.2A, V
GS
=0V,
dI/dt=100A/µs
Min.
-
-
-
Typ.
-
24
19
Max. Units
-1.2
-
-
V
ns
nC
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse test
3.Surface mounted on 1 in
2
copper pad of FR4 board ; 270℃/W when mounted on min. copper pad.
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
2
AP2305AGN-HF
40
36
32
T
A
=25
o
C
-I
D
, Drain Current (A)
30
T
A
=150
o
C
-5.0V
-4.0V
-4.0V
-I
D
, Drain Current (A)
-5.0V
28
24
65mΩ
-3.0V
20
20
-3.0V
16
12
10
V
G
= -2.0V
8
V
G
= -2.0V
4
0
0
1
2
3
4
5
6
7
8
9
0
0
1
2
3
4
5
6
7
-V
DS
, Drain-to-Source Voltage (V)
-V
DS
, Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
300
1.8
I
D
= -1.0A
T
A
=25
o
C
200
1.6
I
D
= -3.0A
V
GS
= -4.5V
Normalized R
DS(ON)
0
2
4
6
8
10
12
R
DS(ON)
(m
Ω
)
1.4
1.2
100
1
0.8
0
0.6
-50
0
50
100
150
-V
GS
, Gate-to-Source Voltage (V)
T
j
, Junction Temperature ( C)
o
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
1.5
100
10
T
j
=150 C
-I
S
(A)
1
o
T
j
=25 C
o
-V
GS(th)
(V)
1
0.5
0.1
0.01
0
0.4
0.8
1.2
1.6
0
-50
0
50
100
150
-V
SD
, Source-to-Drain Voltage (V)
T
j
, Junction Temperature (
o
C)
Fig 5. Forward Characteristic of
Reverse Diode
Fig 6. Gate Threshold Voltage v.s.
Junction Temperature
3
AP2305AGN-HF
12
1000
f=1.0MHz
Ciss
10
-V
GS
, Gate to Source Voltage (V)
I
D
= -3.2A
V
DS
= -24V
8
65mΩ
C (pF)
100
6
Coss
Crss
4
2
0
0
2
4
6
8
10
12
10
1
5
9
13
17
21
25
29
Q
G
, Total Gate Charge (nC)
-V
DS
, Drain-to-Source Voltage (V)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
100
1
DUTY=0.5
Normalized Thermal Response (R
thja
)
0.2
10
0.1
0.1
-I
D
(A)
0.05
1
1ms
P
DM
t
0.01
T
Duty factor = t/T
Peak T
j
= P
DM
x R
thja
+ T
a
10ms
0.1
0.01
Single pulse
100ms
T
A
=25 C
Single Pulse
0.01
0.1
1
10
100
Rthja = 270℃/W
o
1s
DC
0.001
0.0001
0.001
0.01
0.1
1
10
100
1000
-V
DS
, Drain-to-Source Voltage (V)
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
V
DS
90%
V
G
Q
G
-4.5V
Q
GS
Q
GD
10%
V
GS
t
d(on)
t
r
t
d(off)
t
f
Charge
Q
Fig 11. Switching Time Waveform
Fig 12. Gate Charge Waveform
4
ADVANCED POWER ELECTRONICS CORP.
Package Outline : SOT-23
D
D1
SYMBOLS
MIN
Millimeters
NOM
MAX
A
A1
E1
A2
E
D1
1.00
0.00
0.10
0.30
1.70
2.70
2.40
1.40
1.15
--
0.15
0.40
2.00
2.90
2.65
1.50
1.30
0.10
0.25
0.50
2.30
3.10
3.00
1.60
e
D
E
E1
e
1.All Dimension Are In Millimeters.
A
A2
A1
2.Dimension Does Not Include Mold Protrusions.
Part Marking Information & Packing : SOT-23
Part Number : N7
N7YY
Date Code : YY
YY:2004,2008,2012…
YY:2003,2007,2011…
YY:2002,2006,2010…
YY:2001,2005,2009…
5
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