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CR2010-2W-1020DSNT

Description
Fixed Resistor, Metal Glaze/thick Film, 0.5W, 102ohm, 200V, 0.5% +/-Tol, -100,100ppm/Cel, 2010,
CategoryPassive components    The resistor   
File Size677KB,6 Pages
ManufacturerVENKEL LTD
Environmental Compliance
Download Datasheet Parametric View All

CR2010-2W-1020DSNT Overview

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 102ohm, 200V, 0.5% +/-Tol, -100,100ppm/Cel, 2010,

CR2010-2W-1020DSNT Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid836433161
Reach Compliance Codenot_compliant
ECCN codeEAR99
structureChip
JESD-609 codee3
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.56 mm
Package length5 mm
Package formSMT
Package width2.5 mm
method of packingTR
Rated power dissipation(P)0.5 W
resistance102 Ω
Resistor typeFIXED RESISTOR
seriesCR2010-2W(D TOL)
size code2010
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Tolerance0.5%
Operating Voltage200 V
Chip Resistors – CR, LCR and ULCR
Features
Flat Chip Resistors for surface mount applications
LCR and ULCR for current sensing applications
Dimensions
L
C
C
C
w
C
T
01005
L (Length) Inches
(mm)
W (Width) Inches
(mm)
T (Thickness) Inches
(mm)
C (End Band) Inches
(mm)
0.016 ± .0008
(0.4 ± 0.02)
0.008 ± .0008
(0.2 ± 0.02)
0.005 ± .0008
(0.13 ± 0.02)
0.003 ± .001
(0.08 ± 0.03)
0201
0.024 ± .002
(0.6 ± 0.05)
0.012 ± .001
(0.3 ± 0.02)
0.010 ± .002
(0.25 ± 0.05)
0.006 ± .002
(0.15 ± 0.05)
0402
0.040 ± .002
(1.0 ± 0.05)
0.020 ± .001
(0.5 ± 0.02)
0.014 ± .002
(0.35 ± .05)
0.008 ± .004
(0.2 ± 0.1)
0603
0.063 ± .004
(1.6 ± 0.1)
0.031 ± .004
(0.8 ± 0.1)
0.018 ± .004
(0.45 ± 0.1)
0.012 ± .006
(0.30 ± 0.15)
0805
0.079 ± .006
(2.0 ± 0.15)
0.050 ± .006
(1.25 ± 0.15)
0.018 ± .006
(0.45 ± 0.15)
0.014 ± .006
(0.35 ± 0.15)
1206
0.126 ± .006
(3.2 ± 0.15)
0.063 ± .006
(1.6 ± 0.15)
0.022 ± .006
(0.56 ± 0.15)
0.020 ± .008
(0.50 ± 0.20)
1210
0.126 ± .006
(3.2 ± 0.15)
0.098 ± .006
(2.50 ± 0.15)
0.022 ± .006
(0.56 ± 0.15)
0.020 ± .008
(0.50 ± 0.20)
2010
0.197 ± .006
(5.0 ± 0.15)
0.098 ± .006
(2.50 ± 0.15)
0.022 ± .006
(0.56 ± 0.15)
0.024 ± .008
(0.60 ± 0.20)
2512*
0.248 ± .006
(6.3 ± 0.15)
0.126 ± .006
(3.2 ± 0.15)
0.022 ± .006
(0.56 ± 0.15)
0.024 ± .008
(0.60 ± 0.20)
Structure
CR Series
3
2
*
ULCR. See page 43
3
2
LCR Series
4
5
6
1
Description
1
2
3
4
5
6
Substrate
Resistive element
Protective coating
Inner termination
Inner Plating
Outer Plating
Alumina
Ruthenium Oxide (RuO
2
)
Boro-Silicate Glass
Silver Palladium (Ag-Pd)
Nickel (Ni)
Solder Plating,
100% matte Tin (Sn)
4
5
6
7
1
Description
1
2
3
4
5
6
7
Substrate
Resistive element
Protective coating
Inner termination
1st Plating
2nd Plating
3rd Plating
Alumina
Silver Palladium (Ag-Pd)
Boro-Silicate Glass
Silver Palladium (Ag-Pd)
Copper (Cu)
Nickel (Ni)
Solder Plating,
100% matte Tin (Sn)
All components in this section are RoHS compliant per the EU directives and definitions.
For standard resistance values, please see “EIA Standard Resistance Values” on page 62.
40
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