M55342E12B109AP-W datasheet, PDF

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M55342E12B109AP-W: DescriptionFixed Resistor, Thin Film, 0.1W, 109ohm, 50V, 0.1% +/-Tol, 25ppm/Cel, Surface Mount, 0603, CHIP; CategoryPassive components The resistor; File Size993KB，1 Pages; ManufacturerState of the Art Inc.

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M55342E12B109AP-W Overview

Fixed Resistor, Thin Film, 0.1W, 109ohm, 50V, 0.1% +/-Tol, 25ppm/Cel, Surface Mount, 0603, CHIP

M55342E12B109AP-W Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	1916918188
package instruction	CHIP
Reach Compliance Code	not_compliant
ECCN code	EAR99
Other features	PRECISION
structure	Chip
JESD-609 code	e0
Installation features	SURFACE MOUNT
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-65 °C
Package height	0.46 mm
Package length	1.58 mm
Package shape	RECTANGULAR PACKAGE
Package form	SMT
Package width	0.81 mm
method of packing	WAFFLE TRAY
Rated power dissipation(P)	0.1 W
Rated temperature	70 °C
Guideline	MIL-PRF-55342/12
resistance	109 Ω
Resistor type	FIXED RESISTOR
size code	0603
surface mount	YES
technology	THIN FILM
Temperature Coefficient	25 ppm/°C
Terminal surface	Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Terminal shape	WRAPAROUND
Tolerance	0.1%
Operating Voltage	50 V

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State of the Art, Inc.

Precision Thin Film Chip Resistor

MIL-PRF-55342/12 Solderable RM0603

5.6Ω to 576 kΩ

0.1, 0.25, 0.5, 1, 2, 5, 10

25, 50, 100

100 mW

50 V

-65 to 150°C

M, P, R, S, U, V, T

Noise

Performance

Resistance Range*

Tolerances (± %)*

TCR (± ppm/°C)*

Power Rating

Voltage Rating

Operating Range

Product Levels

Noise (dB)

-10

-20

-30

-40

125

100

ceramic board

Power Dissipation

fiber epoxy board

*see QPL55342 for part number availability

Resistance Value (Ω)

Temperature Rise (°C)

0.25 0.50 0.75 1.00 1.25

Power (W)

Maximum Allowable Drift

Temperature Characteristic

TCR (ppm/°C)

Thermal Shock

Power Conditioning

Low Temperature Operation

Short Time Overload

High Temperature Exposure

Moisture Resistance

Life (Qualification)

Life (FR Level)

Resistance to Soldering Heat

Resistance to Bonding Exposure

±25

±0.1%

±0.2%

±0.1%

±0.2%

±0.5%

±2.0%

±0.2%

±50

±0.25%

±0.1%

±0.2%

±0.4%

±0.5%

±2.0%

±0.25%

±100

±0.5%

±0.25%

±0.5%

±2.0%

±0.25%

0.5

Drift (|%∆R|)

0.4

0.3

0.2

0.1

Life Test

Percent Power

100

Power Derating

4k 6k

Hours

10k

-10

150

Ambient Temperature (°C)

Part Number

M55342E12B100AS -TR

Packaging: -TR: Tape & Reel

Product Level (/1000 hrs.): M: 1%

Resistance Value and Tolerance:

Three numerals and a letter indicating

decimal, value range, and tolerance

-W: Waffle Tray

P: 0.1%

R & U: 0.01%

S & V: 0.001%

T: Space 0.001%

Ω: A: 0.1% R: 0.25% W: 0.5% D: 1% G: 2% J: 5% M: 10%

kΩ: B: 0.1% U: 0.25% Y: 0.5% E: 1% H: 2% K: 5% N: 10%

MΩ: C: 0.1% V: 0.25% Z: 0.5% F: 1% T: 2% L: 5% P: 10%

Termination Material: B: Solderable (SnPb solder over nickel)

Size: 12: RM0603

Temperature Characteristic (ppm/°C): E: ±25

Performance Specification MIL-PRF-55342

H: ±50

K: ±100

Mechanical

Length (a)

Width (b)

Thickness (c)

Top Termination (d)

Bottom Termination (e)

Approximate Weight

Inches

.062(.058 - .070)

.032(.027 - .037)

.018(.010 - .033)

.009(.007 - .017)

.014(.010 - .020)

0.00235 g

Millimeters

1.58(1.47 - 1.78)

0.81(0.69 - 0.94)

0.46(0.25 - 0.84)

0.23(0.18 - 0.43)

0.36(0.25 - 0.51)

.092

Recommended

Minimum

Bond Pads

(inches)

.031

.030

.036

State of the Art, Inc.

www.resistor.com

Specifications Subject to Change Without Notice

2470 Fox Hill Road, State College, PA, USA 16803-1797

Telephone: 814-355-8004 Toll Free: 800-458-3401 Fax: 814-355-2714

All Products Made in the USA

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