|
INA333SJD |
INA333SHKQ |
INA333SKGD1 |
INA333SKGD2 |
INA333SHKJ |
Description |
High Temperature Low Power, Precision Instrumentation Amplifier 8-CDIP SB -55 to 210 |
High Temperature Low Power, Precision Instrumentation Amplifier 8-CFP -55 to 210 |
High Temperature Low Power, Precision Instrumentation Amplifier 0-XCEPT -55 to 210 |
High Temperature Low Power, Precision Instrumentation Amplifier 0-XCEPT -55 to 210 |
High Temperature Low Power, Precision Instrumentation Amplifier 8-CFP -55 to 210 |
Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Maker |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
package instruction |
DIP-8 |
DFP-8 |
DIE-9 |
DIE-9 |
CFP-8 |
Reach Compliance Code |
_compli |
_compli |
compli |
_compli |
_compli |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Factory Lead Time |
1 week |
1 week |
16 weeks |
8 weeks |
1 week |
Is Samacsys |
N |
N |
N |
N |
N |
Amplifier type |
OPERATIONAL AMPLIFIER |
INSTRUMENTATION AMPLIFIER |
OPERATIONAL AMPLIFIER |
INSTRUMENTATION AMPLIFIER |
OPERATIONAL AMPLIFIER |
Maximum average bias current (IIB) |
0.0014 µA |
0.0014 µA |
0.0014 µA |
0.0014 µA |
0.0014 µA |
Nominal bandwidth (3dB) |
0.15 MHz |
0.15 MHz |
0.15 MHz |
0.15 MHz |
0.15 MHz |
Minimum Common Mode Rejection Ratio |
100 dB |
100 dB |
100 dB |
100 dB |
100 dB |
Maximum input offset voltage |
25 µV |
25 µV |
25 µV |
25 µV |
25 µV |
JESD-30 code |
R-CDIP-T8 |
R-CDFP-G8 |
R-XUUC-N9 |
R-XUUC-N9 |
R-CDFP-F8 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
8 |
8 |
9 |
9 |
8 |
Maximum operating temperature |
210 °C |
210 °C |
210 °C |
210 °C |
210 °C |
Minimum operating temperature |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
UNSPECIFIED |
UNSPECIFIED |
CERAMIC, METAL-SEALED COFIRED |
encapsulated code |
DIP |
QFP |
DIE |
DIE |
DFP |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
IN-LINE |
FLATPACK |
UNCASED CHIP |
UNCASED CHIP |
FLATPACK |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
Nominal slew rate |
0.04 V/us |
0.04 V/us |
0.04 V/us |
0.04 V/us |
0.04 V/us |
Supply voltage upper limit |
7 V |
7 V |
7 V |
7 V |
7 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
surface mount |
NO |
YES |
YES |
YES |
YES |
Temperature level |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
Terminal form |
THROUGH-HOLE |
GULL WING |
NO LEAD |
NO LEAD |
FLAT |
Terminal location |
DUAL |
DUAL |
UPPER |
UPPER |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
Minimum voltage gain |
1 |
1 |
1 |
1 |
1 |
Base Number Matches |
1 |
1 |
1 |
1 |
1 |
Parts packaging code |
DIP |
DFP |
DIE |
- |
DFP |
Contacts |
8 |
8 |
9 |
- |
8 |
Architecture |
VOLTAGE-FEEDBACK |
- |
VOLTAGE-FEEDBACK |
- |
VOLTAGE-FEEDBACK |
Nominal Common Mode Rejection Ratio |
113 dB |
- |
113 dB |
- |
113 dB |
frequency compensation |
YES |
- |
YES |
- |
YES |
length |
10.29 mm |
6.9 mm |
- |
1.778 mm |
6.9 mm |
low-dissonance |
YES |
- |
YES |
- |
YES |
micropower |
YES |
- |
YES |
- |
YES |
Encapsulate equivalent code |
DIP8,.3 |
SOP8,.45 |
- |
- |
FL8,.2 |
method of packing |
TUBE |
TUBE |
- |
TUBE |
TUBE |
power |
NO |
- |
NO |
- |
NO |
power supply |
2/5 V |
2/5 V |
- |
- |
2/5 V |
Programmable power |
NO |
- |
NO |
- |
NO |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
- |
Not Qualified |
Maximum seat height |
4.45 mm |
2.8 mm |
- |
- |
1.65 mm |
Maximum slew rate |
0.345 mA |
0.345 mA |
0.08 mA |
- |
0.345 mA |
Terminal pitch |
2.54 mm |
1.27 mm |
- |
- |
1.27 mm |
Nominal Uniform Gain Bandwidth |
150 kHz |
- |
150 kHz |
- |
150 kHz |
broadband |
NO |
- |
NO |
- |
NO |
width |
7.37 mm |
5.65 mm |
- |
1.473 mm |
5.65 mm |