EM6AA320BI-4MS datasheet, PDF - EEWORLD Datasheet

EM6AA320BI-4MS: DescriptionDDR DRAM, 8MX32, 0.7ns, CMOS, PBGA144; Categorystorage storage; File Size365KB，16 Pages; ManufacturerEtron; Websitehttp://www.etron.com/

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EM6AA320BI-4MS Overview

DDR DRAM, 8MX32, 0.7ns, CMOS, PBGA144

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	105978794
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	0.7 ns
Maximum clock frequency (fCLK)	250 MHz
I/O type	COMMON
interleaved burst length	2,4,8
JESD-30 code	S-PBGA-B144
memory density	268435456 bit
Memory IC Type	DDR DRAM
memory width	32
Number of terminals	144
word count	8388608 words
character code	8000000
Maximum operating temperature	70 °C
Minimum operating temperature
organize	8MX32
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	FBGA
Encapsulate equivalent code	BGA144,12X12,32
Package shape	SQUARE
Package form	GRID ARRAY, FINE PITCH
power supply	2.5 V
Certification status	Not Qualified
refresh cycle	4096
Continuous burst length	2,4,8
Maximum standby current	0.1 A
Maximum slew rate	1 mA
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM

	EM6AA320BI-4MS	EM6AA320BI-6MSG
Description	DDR DRAM, 8MX32, 0.7ns, CMOS, PBGA144	DDR DRAM, 8MX32, 0.7ns, CMOS, PBGA144
Is it Rohs certified?	incompatible	conform to
Objectid	105978794	106284797
Reach Compliance Code	compliant	compliant
ECCN code	EAR99	EAR99
Maximum access time	0.7 ns	0.7 ns
Maximum clock frequency (fCLK)	250 MHz	166 MHz
I/O type	COMMON	COMMON
interleaved burst length	2,4,8	2,4,8
JESD-30 code	S-PBGA-B144	S-PBGA-B144
memory density	268435456 bit	268435456 bit
Memory IC Type	DDR DRAM	DDR DRAM
memory width	32	32
Number of terminals	144	144
word count	8388608 words	8388608 words
character code	8000000	8000000
Maximum operating temperature	70 °C	70 °C
organize	8MX32	8MX32
Output characteristics	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	FBGA	FBGA
Encapsulate equivalent code	BGA144,12X12,32	BGA144,12X12,32
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH
power supply	2.5 V	2.5 V
Certification status	Not Qualified	Not Qualified
refresh cycle	4096	4096
Continuous burst length	2,4,8	2,4,8
Maximum standby current	0.1 A	0.08 A
Maximum slew rate	1 mA	0.9 mA
Nominal supply voltage (Vsup)	2.5 V	2.5 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal form	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM

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