Array/Network Resistor, Bussed, Metal Glaze/thick Film, 2W, 100V, 2% +/-Tol, 100ppm/Cel, Through Hole Mount, DIP-14
Parameter Name | Attribute value |
Objectid | 1919978076 |
package instruction | DIP-14 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
structure | Molded |
Component power consumption | 0.125 W |
The first element resistor | 560000 Ω |
Lead length | 3.43 mm |
lead spacing | 2.54 mm |
Installation features | THROUGH HOLE MOUNT |
Network Type | BUSSED |
Number of components | 13 |
Number of functions | 1 |
Number of terminals | 14 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package height | 4.57 mm |
Package length | 19.43 mm |
Package shape | RECTANGULAR PACKAGE |
Package form | DIP |
Package width | 6.71 mm |
Rated power dissipation(P) | 2 W |
Rated temperature | 70 °C |
resistance | 560000 Ω |
Resistor type | ARRAY/NETWORK RESISTOR |
surface mount | NO |
technology | METAL GLAZE/THICK FILM |
Temperature Coefficient | 100 ppm/°C |
Temperature coefficient tracking | 50 ppm/°C |
Terminal shape | FLAT |
Tolerance | 2% |
Operating Voltage | 100 V |
4114R-002-564 | 4108R-002-564 | 4118R-002-560 | |
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Description | Array/Network Resistor, Bussed, Metal Glaze/thick Film, 2W, 100V, 2% +/-Tol, 100ppm/Cel, Through Hole Mount, DIP-14 | RESISTOR, NETWORK, FILM, BUSSED, 1.69W, THROUGH HOLE MOUNT, DIP-8 | Array/Network Resistor, Bussed, Metal Glaze/thick Film, 2.5W, 100V, 2% +/-Tol, 100ppm/Cel, Through Hole Mount, DIP-18 |
Objectid | 1919978076 | 1919977950 | 1919978324 |
package instruction | DIP-14 | , | DIP-18 |
Reach Compliance Code | compliant | unknown | compliant |
ECCN code | EAR99 | EAR99 | EAR99 |
structure | Molded | Molded | Molded |
Component power consumption | 0.125 W | 0.125 W | 0.125 W |
The first element resistor | 560000 Ω | 560000 Ω | 56 Ω |
Lead length | 3.43 mm | 3.43 mm | 3.43 mm |
lead spacing | 2.54 mm | 2.54 mm | 2.54 mm |
Installation features | THROUGH HOLE MOUNT | THROUGH HOLE MOUNT | THROUGH HOLE MOUNT |
Network Type | BUSSED | BUSSED | BUSSED |
Number of components | 13 | 7 | 17 |
Number of functions | 1 | 1 | 1 |
Number of terminals | 14 | 8 | 18 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C |
Package height | 4.57 mm | 4.57 mm | 4.57 mm |
Package length | 19.43 mm | 11.81 mm | 24.51 mm |
Package shape | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE |
Package form | DIP | DIP | DIP |
Package width | 6.71 mm | 6.71 mm | 6.71 mm |
Rated power dissipation(P) | 2 W | 1.69 W | 2.5 W |
Rated temperature | 70 °C | 70 °C | 70 °C |
resistance | 560000 Ω | 560000 Ω | 56 Ω |
Resistor type | ARRAY/NETWORK RESISTOR | ARRAY/NETWORK RESISTOR | ARRAY/NETWORK RESISTOR |
surface mount | NO | NO | NO |
technology | METAL GLAZE/THICK FILM | METAL GLAZE/THICK FILM | METAL GLAZE/THICK FILM |
Temperature Coefficient | 100 ppm/°C | 100 ppm/°C | 100 ppm/°C |
Temperature coefficient tracking | 50 ppm/°C | 50 ppm/°C | 50 ppm/°C |
Terminal shape | FLAT | FLAT | FLAT |
Tolerance | 2% | 2% | 2% |
Operating Voltage | 100 V | 100 V | 100 V |
JESD-609 code | - | e0 | e0 |
Terminal surface | - | Tin/Lead (Sn60Pb40) | Tin/Lead (Sn/Pb) |