STM32F417IGH7XXXTR datasheet, PDF - EEWORLD Datasheet

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STM32F417IGH7XXXTR: DescriptionIC,MICROCONTROLLER,32-BIT,CORTEX-M4 CPU,CMOS,BGA,176PIN,PLASTIC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size5MB，186 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

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STM32F417IGH7XXXTR Overview

IC,MICROCONTROLLER,32-BIT,CORTEX-M4 CPU,CMOS,BGA,176PIN,PLASTIC

STM32F417IGH7XXXTR Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Objectid	113412632
Reach Compliance Code	compliant
ECCN code	3A991.A.2
Has ADC	YES
Address bus width	24
bit size	32
CPU series	CORTEX-M4
maximum clock frequency	26 MHz
DMA channel	YES
External data bus width	32
JESD-30 code	S-PBGA-B176
length	10 mm
Number of I/O lines	140
Number of terminals	176
On-chip program ROM width	8
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	FBGA
Encapsulate equivalent code	BGA176,15X15,25
Package shape	SQUARE
Package form	GRID ARRAY, FINE PITCH
power supply	2/3.3 V
Certification status	Not Qualified
RAM (bytes)	196608
rom(word)	1048576
ROM programmability	FLASH
speed	168 MHz
Maximum slew rate	117 mA
Maximum supply voltage	3.6 V
Minimum supply voltage	1.8 V
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.65 mm
Terminal location	BOTTOM
width	10 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

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STM32F415xx

STM32F417xx

ARM Cortex-M4 32b MCU+FPU, 210DMIPS, up to 1MB Flash/192+4KB RAM,

crypto, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera

Datasheet

-

production data

FBGA

•

LQFP64 (10 × 10 mm)

LQFP100 (14 × 14 mm)

LQFP144 (20 × 20 mm)

LQFP176 (24 × 24 mm)

WLCSP90

UFBGA176

(10 × 10 mm)

•

Features

•

Core: ARM 32-bit Cortex™-M4 CPU with FPU,

Adaptive real-time accelerator (ART

Accelerator™) allowing 0-wait state execution

from Flash memory, frequency up to 168 MHz,

memory protection unit, 210 DMIPS/

1.25 DMIPS/MHz (Dhrystone 2.1), and DSP

instructions

•

Memories

– Up to 1 Mbyte of Flash memory

– Up to 192+4 Kbytes of SRAM including 64-

Kbyte of CCM (core coupled memory) data

RAM

– Flexible static memory controller

supporting Compact Flash, SRAM,

PSRAM, NOR and NAND memories

•

LCD parallel interface, 8080/6800 modes

•

Clock, reset and supply management

– 1.8 V to 3.6 V application supply and I/Os

– POR, PDR, PVD and BOR

– 4-to-26 MHz crystal oscillator

– Internal 16 MHz factory-trimmed RC (1%

accuracy)

– 32 kHz oscillator for RTC with calibration

– Internal 32 kHz RC with calibration

•

Low power

– Sleep, Stop and Standby modes

– V

BAT

supply for RTC, 20×32 bit backup

registers + optional 4 KB backup SRAM

•

3×12-bit, 2.4 MSPS A/D converters: up to 24

channels and 7.2 MSPS in triple interleaved

mode

•

2×12-bit D/A converters

•

General-purpose DMA: 16-stream DMA

controller with FIFOs and burst support

•

Up to 17 timers: up to twelve 16-bit and two 32-

bit timers up to 168 MHz, each with up to 4

•

•

•

•

•

•

•

•

IC/OC/PWM or pulse counter and quadrature

(incremental) encoder input

Debug mode

– Serial wire debug (SWD) & JTAG

interfaces

– Cortex-M4 Embedded Trace Macrocell™

Up to 140 I/O ports with interrupt capability

– Up to 136 fast I/Os up to 84 MHz

– Up to 138 5 V-tolerant I/Os

Up to 15 communication interfaces

– Up to 3 × I

2

C interfaces (SMBus/PMBus)

– Up to 4 USARTs/2 UARTs (10.5 Mbit/s, ISO

7816 interface, LIN, IrDA, modem control)

– Up to 3 SPIs (42 Mbits/s), 2 with muxed

full-duplex I

2

S to achieve audio class

accuracy via internal audio PLL or external

clock

– 2 × CAN interfaces (2.0B Active)

– SDIO interface

Advanced connectivity

– USB 2.0 full-speed device/host/OTG

controller with on-chip PHY

– USB 2.0 high-speed/full-speed

device/host/OTG controller with dedicated

DMA, on-chip full-speed PHY and ULPI

– 10/100 Ethernet MAC with dedicated DMA:

supports IEEE 1588v2 hardware, MII/RMII

8- to 14-bit parallel camera interface up to

54 Mbytes/s

Cryptographic acceleration: hardware

acceleration for AES 128, 192, 256, Triple

DES, HASH (MD5, SHA-1), and HMAC

True random number generator

CRC calculation unit

96-bit unique ID

RTC: subsecond accuracy, hardware calendar

Table 1. Device summary

Reference

Part number

STM32F415RG, STM32F415VG, STM32F415ZG,

STM32F415OG

STM32F417VG, STM32F417IG, STM32F417ZG,

STM32F417VE, STM32F417ZE, STM32F417IE

STM32F415xx

STM32F417xx

June 2013

This is information on a product in full production.

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www.st.com

1

Contents

STM32F415xx, STM32F417xx

Contents

1

2

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

2.1

2.2

Full compatibility throughout the family . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Device overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

2.2.1

2.2.2

2.2.3

2.2.4

2.2.5

2.2.6

2.2.7

2.2.8

2.2.9

2.2.10

2.2.11

2.2.12

2.2.13

2.2.14

2.2.15

2.2.16

2.2.17

2.2.18

2.2.19

2.2.20

2.2.21

2.2.22

2.2.23

2.2.24

2.2.25

2.2.26

2.2.27

2.2.28

2.2.29

ARM

®

Cortex™-M4F core with embedded Flash and SRAM . . . . . . . . 19

Adaptive real-time memory accelerator (ART Accelerator™) . . . . . . . . 19

Memory protection unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Embedded Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

CRC (cyclic redundancy check) calculation unit . . . . . . . . . . . . . . . . . . 20

Embedded SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Multi-AHB bus matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

DMA controller (DMA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Flexible static memory controller (FSMC) . . . . . . . . . . . . . . . . . . . . . . . 22

Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . 22

External interrupt/event controller (EXTI) . . . . . . . . . . . . . . . . . . . . . . . 22

Clocks and startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Regulator ON/OFF and internal reset ON/OFF availability . . . . . . . . . . 29

Real-time clock (RTC), backup SRAM and backup registers . . . . . . . . 29

Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

V

BAT

operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Inter-integrated circuit interface (I²C) . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Universal synchronous/asynchronous receiver transmitters (USART) . 33

Serial peripheral interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Inter-integrated sound (I2S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Audio PLL (PLLI2S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Secure digital input/output interface (SDIO) . . . . . . . . . . . . . . . . . . . . . 35

Ethernet MAC interface with dedicated DMA and IEEE 1588 support . 35

Controller area network (bxCAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

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2.2.30

2.2.31

2.2.32

2.2.33

2.2.34

2.2.35

2.2.36

2.2.37

2.2.38

2.2.39

2.2.40

Contents

Universal serial bus on-the-go full-speed (OTG_FS) . . . . . . . . . . . . . . . 36

Universal serial bus on-the-go high-speed (OTG_HS) . . . . . . . . . . . . . 36

Digital camera interface (DCMI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Cryptographic acceleration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Random number generator (RNG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

General-purpose input/outputs (GPIOs) . . . . . . . . . . . . . . . . . . . . . . . . 37

Analog-to-digital converters (ADCs) . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Digital-to-analog converter (DAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Serial wire JTAG debug port (SWJ-DP) . . . . . . . . . . . . . . . . . . . . . . . . . 38

Embedded Trace Macrocell™ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

3

4

5

Pinouts and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

5.1

Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

5.1.1

5.1.2

5.1.3

5.1.4

5.1.5

5.1.6

5.1.7

Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

5.2

5.3

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

5.3.1

5.3.2

5.3.3

5.3.4

5.3.5

5.3.6

5.3.7

5.3.8

5.3.9

5.3.10

General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

VCAP_1/VCAP_2 external capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

Operating conditions at power-up / power-down (regulator ON) . . . . . . 81

Operating conditions at power-up / power-down (regulator OFF) . . . . . 81

Embedded reset and power control block characteristics . . . . . . . . . . . 81

Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

Wakeup time from low-power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 97

Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 100

PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101

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5.3.11

5.3.12

5.3.13

5.3.14

5.3.15

5.3.16

5.3.17

5.3.18

5.3.19

5.3.20

5.3.21

5.3.22

5.3.23

5.3.24

5.3.25

5.3.26

5.3.27

5.3.28

STM32F415xx, STM32F417xx

PLL spread spectrum clock generation (SSCG) characteristics . . . . . 103

Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107

Absolute maximum ratings (electrical sensitivity) . . . . . . . . . . . . . . . . 109

I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 110

I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110

NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114

TIM timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

Communications interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117

12-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130

Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 135

V

BAT

monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135

Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

DAC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

FSMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138

Camera interface (DCMI) timing specifications . . . . . . . . . . . . . . . . . . 156

SD/SDIO MMC card host interface (SDIO) characteristics . . . . . . . . . 157

RTC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158

6

Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159

6.1

6.2

Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159

Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170

7

Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171

Appendix A Application block diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172

A.1

A.2

A.3

USB OTG full speed (FS) interface solutions . . . . . . . . . . . . . . . . . . . . . 172

USB OTG high speed (HS) interface solutions . . . . . . . . . . . . . . . . . . . . 174

Ethernet interface solutions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175

8

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177

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List of tables

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Table 19.

Table 20.

Table 21.

Table 22.

Table 23.

Table 24.

Table 25.

Table 26.

Table 27.

Table 28.

Table 29.

Table 30.

Table 31.

Table 32.

Table 33.

Table 34.

Table 35.

Table 36.

Table 37.

Table 38.

Table 39.

Table 40.

Table 41.

Table 42.

Table 43.

Table 44.

Table 45.

Table 46.

Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

STM32F415xx and STM32F417xx: features and peripheral counts. . . . . . . . . . . . . . . . . . 13

Regulator ON/OFF and internal reset ON/OFF availability. . . . . . . . . . . . . . . . . . . . . . . . . 29

Timer feature comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

USART feature comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Legend/abbreviations used in the pinout table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

STM32F41x pin and ball definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

FSMC pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

Alternate function mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

STM32F41x register boundary addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

Limitations depending on the operating power supply range . . . . . . . . . . . . . . . . . . . . . . . 80

VCAP_1/VCAP_2 operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

Operating conditions at power-up / power-down (regulator ON) . . . . . . . . . . . . . . . . . . . . 81

Operating conditions at power-up / power-down (regulator OFF). . . . . . . . . . . . . . . . . . . . 81

Embedded reset and power control block characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 82

Typical and maximum current consumption in Run mode, code with data processing

running from Flash memory (ART accelerator enabled) or RAM . . . . . . . . . . . . . . . . . . . 84

Typical and maximum current consumption in Run mode, code with data processing

running from Flash memory (ART accelerator disabled) . . . . . . . . . . . . . . . . . . . . . . . . . . 85

Typical and maximum current consumption in Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . 88

Typical and maximum current consumptions in Stop mode . . . . . . . . . . . . . . . . . . . . . . . . 89

Typical and maximum current consumptions in Standby mode . . . . . . . . . . . . . . . . . . . . . 89

Typical and maximum current consumptions in V

BAT

mode. . . . . . . . . . . . . . . . . . . . . . . . 90

Switching output I/O current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

Peripheral current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94

Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97

Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97

HSE 4-26 MHz oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99

LSE oscillator characteristics (f

LSE

= 32.768 kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100

HSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100

LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101

Main PLL characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

PLLI2S (audio PLL) characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

SSCG parameters constraint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103

Flash memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

Flash memory programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

Flash memory programming with V

PP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107

Flash memory endurance and data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107

EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108

EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109

ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109

Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110

I/O current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110

DocID022063 Rev 4

5/186

STM32F417IGH7XXXTR Related Products

	STM32F417IGH7XXXTR	STM32F417IEH6XXXTR	STM32F417IEH7XXXTR	STM32F417IGH6XXXTR	STM32F417IGT7XXXTR	STM32F417VET6XXXTR	STM32F417ZET6XXXTR
Description	IC,MICROCONTROLLER,32-BIT,CORTEX-M4 CPU,CMOS,BGA,176PIN,PLASTIC	IC,MICROCONTROLLER,32-BIT,CORTEX-M4 CPU,CMOS,BGA,176PIN,PLASTIC	IC,MICROCONTROLLER,32-BIT,CORTEX-M4 CPU,CMOS,BGA,176PIN,PLASTIC	IC,MICROCONTROLLER,32-BIT,CORTEX-M4 CPU,CMOS,BGA,176PIN,PLASTIC	IC,MICROCONTROLLER,32-BIT,CORTEX-M4 CPU,CMOS,QFP,176PIN,PLASTIC	IC,MICROCONTROLLER,32-BIT,CORTEX-M4 CPU,CMOS,QFP,100PIN,PLASTIC	IC,MICROCONTROLLER,32-BIT,CORTEX-M4 CPU,CMOS,QFP,144PIN,PLASTIC
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Objectid	113412632	113412644	113412648	113412628	113412624	113412604	113412612
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2	3A991.A.2
Has ADC	YES	YES	YES	YES	YES	YES	YES
Address bus width	24	24	24	24	24	24	24
bit size	32	32	32	32	32	32	32
CPU series	CORTEX-M4	CORTEX-M4	CORTEX-M4	CORTEX-M4	CORTEX-M4	CORTEX-M4	CORTEX-M4
maximum clock frequency	26 MHz	26 MHz	26 MHz	26 MHz	26 MHz	26 MHz	26 MHz
DMA channel	YES	YES	YES	YES	YES	YES	YES
External data bus width	32	32	32	32	32	32	32
JESD-30 code	S-PBGA-B176	S-PBGA-B176	S-PBGA-B176	S-PBGA-B176	S-PQFP-G176	S-PQFP-G100	S-PQFP-G144
length	10 mm	10 mm	10 mm	10 mm	24 mm	14 mm	20 mm
Number of I/O lines	140	140	140	140	140	82	114
Number of terminals	176	176	176	176	176	100	144
On-chip program ROM width	8	8	8	8	8	8	8
Maximum operating temperature	105 °C	85 °C	105 °C	85 °C	105 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	FBGA	FBGA	FBGA	FBGA	QFP	QFP	QFP
Encapsulate equivalent code	BGA176,15X15,25	BGA176,15X15,25	BGA176,15X15,25	BGA176,15X15,25	QFP176,1.0SQ,20	QFP100,.63SQ,20	QFP144,.87SQ,20
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	FLATPACK	FLATPACK	FLATPACK
power supply	2/3.3 V	2/3.3 V	2/3.3 V	2/3.3 V	2/3.3 V	2/3.3 V	2/3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	196608	196608	196608	196608	196608	196608	196608
rom(word)	1048576	524288	524288	1048576	1048576	524288	524288
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
speed	168 MHz	168 MHz	168 MHz	168 MHz	168 MHz	168 MHz	168 MHz
Maximum slew rate	117 mA	109 mA	117 mA	109 mA	117 mA	109 mA	109 mA
Maximum supply voltage	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
Nominal supply voltage	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL	BALL	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	QUAD	QUAD	QUAD
width	10 mm	10 mm	10 mm	10 mm	24 mm	14 mm	20 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC

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