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V827565N24SATL-C0

Description
DDR DRAM Module, 128MX72, 0.7ns, CMOS, PDMA184
Categorystorage    storage   
File Size246KB,16 Pages
ManufacturerProMOS Technologies Inc
Download Datasheet Parametric Compare View All

V827565N24SATL-C0 Overview

DDR DRAM Module, 128MX72, 0.7ns, CMOS, PDMA184

V827565N24SATL-C0 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Objectid1125506603
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum access time0.7 ns
Maximum clock frequency (fCLK)166 MHz
I/O typeCOMMON
JESD-30 codeR-PDMA-N184
memory density9663676416 bit
Memory IC TypeDDR DRAM MODULE
memory width72
Number of terminals184
word count134217728 words
character code128000000
Maximum operating temperature70 °C
Minimum operating temperature
organize128MX72
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIMM
Encapsulate equivalent codeDIMM184
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2.5 V
Certification statusNot Qualified
refresh cycle8192
Maximum slew rate10.8 mA
Nominal supply voltage (Vsup)2.5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
V827565N24SA
1GB 184-PIN DDR REGISTERED ECC DIMM
128M x 72
Features
184 Pin Registered 134,217,728 x 72 bit
Organization DDR SDRAM Modules
Utilizes High Performance 128M x 4 DDR
SDRAM in TSOPII and FBGA Package
Single +2.5V (± 0.2V) Power Supply
Single +2.6V (± 0.1V) Power Supply for DDR400
Programmable CAS Latency, Burst Length, and
Wrap Sequence (Sequential & Interleave)
Auto Refresh (CBR) and Self Refresh
All Inputs, Outputs are SSTL-2 Compatible
8192 Refresh Cycles every 64 ms
Serial Presence Detect (SPD)
DDR SDRAM Performance
Component Used
-6
-7
Module Speed
t
CK
t
AC
Description
The V827565N24SA memory module is
organized 134,217,728 x 72 bits in a 184 pin
memory module. The 128M x 72 memory module
uses 18 ProMOS 128M x 4 DDR SDRAM. The x72
modules are ideal for use in high performance
computer systems where increased memory
density and fast access times are required.
-75
-8
D3
(PC400B)
C0
166
(PC333)
Units
MHz
ns
ns
ns
CLK
CLK
Clock Frequency
166
143
133
125
Clock Frequency (max.)
(PC266A) (PC266B)
200
(PC333)
(max.)
(PC200)
Clock Access Time
6
7
7.5
t
CK
Clock Cycle Time CAS Latency = 2
CAS Latency = 2.5
Clock Cycle Time CAS Latency = 2.5
Clock Cycle Time CAS Latency = 3
8
7.5
6
5
3
3
7.5
6
6
3
3
Module Speed
tRCD parameter
A1t
RCD
PC1600 (100MHz @ CL2)
B0 t
RP
PC2100Bparameter @ CL2.5)
tRP (133MHz
B1
C0
PC2100A (133MHz @ CL2)
PC2700 (166MHz @ CL2.5)
V827565N24SA Rev. 1.0 March 2005
1

V827565N24SATL-C0 Related Products

V827565N24SATL-C0 V827565N24SASG-C0 V827565N24SASG-D3 V827565N24SASL-C0
Description DDR DRAM Module, 128MX72, 0.7ns, CMOS, PDMA184 DDR DRAM Module, 128MX72, 0.7ns, CMOS, PDMA184 DDR DRAM Module, 128MX72, 0.65ns, CMOS, PDMA184 DDR DRAM Module, 128MX72, 0.7ns, CMOS, PDMA184
Is it lead-free? Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible
Objectid 1125506603 1125506599 1125506600 1125506601
Reach Compliance Code compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99
Maximum access time 0.7 ns 0.7 ns 0.65 ns 0.7 ns
Maximum clock frequency (fCLK) 166 MHz 166 MHz 200 MHz 166 MHz
I/O type COMMON COMMON COMMON COMMON
JESD-30 code R-PDMA-N184 R-PDMA-N184 R-PDMA-N184 R-PDMA-N184
memory density 9663676416 bit 9663676416 bit 9663676416 bit 9663676416 bit
Memory IC Type DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE DDR DRAM MODULE
memory width 72 72 72 72
Number of terminals 184 184 184 184
word count 134217728 words 134217728 words 134217728 words 134217728 words
character code 128000000 128000000 128000000 128000000
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
organize 128MX72 128MX72 128MX72 128MX72
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIMM DIMM DIMM DIMM
Encapsulate equivalent code DIMM184 DIMM184 DIMM184 DIMM184
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 2.5 V 2.5 V 2.5 V 2.5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 8192 8192 8192 8192
Maximum slew rate 10.8 mA 10.8 mA 11.7 mA 10.8 mA
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V
surface mount NO NO NO NO
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
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