Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BTS3046SDL
MA001111552
PG-TO252-3-11
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
iron
phosphorus
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
Issued
Weight*
Weight
[mg]
3.370
0.140
0.042
139.706
1.745
1.454
25.436
118.460
3.740
0.091
0.000
0.075
0.060
2.879
0.095
0.028
94.488
Average
Mass
[%]
0.86
0.04
0.01
35.66
0.45
0.37
6.49
30.23
0.95
0.02
0.00
0.02
0.02
0.73
0.02
0.01
24.12
29. August 2013
391.81 mg
Sum
[%]
0.86
Average
Mass
[ppm]
8600
357
107
35.71
0.45
356566
4453
3710
64920
37.09
0.95
302342
9546
232
0.02
1
192
154
0.77
7348
241
72
24.15
241159
241472
1000000
7694
233
370972
9546
357030
4453
Sum
[ppm]
8600
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com