Data Sheet
SOD323-FL
Process Highlights
POWER DISCRETE
Introduction
The SOD323-FL package is part of the FLAT series
of compact surface mount packages which allow
communication equipment to be miniaturized. The Cu
clip structure of interconnect features reduces electrical
resistance and enhance thermal performance compared to
wire-bonded products.
This package may also be know as:
• US-FLAT
• TURP
• MicroSMP
• Bare copper leadframe with no plating
• Interconnect: Cu clips technology for better electrical and thermal
performance
• Plating: 100% matte Sn
• Marking: Pen type laser
Standard Materials
•
•
•
•
Leadframe: Bare copper
Die attach: Solder paste
Interconnect: Cu clips
Mold compound: Halogen free
Reliability Qualification
Amkor devices are assembled with proven reliable semiconductor materials.
All test includes pre-condition of: Ta = 85°C/Rh = 85%, 24 hrs with IR reflow,
Ta = 260°C, 4X
• Temperature & Humidity Storage, Ta = 85°C/Rh = 85%, 500 hrs
• Pressure Cooker, Ta = 121°C/Rh = 100%/P = 2 atm, 500 hrs
• Temperature Cycle, -65~150°C, 1000 cycles
Application
The FLAT packages are suitable for the application of
high-efficiency diodes, in small & medium size:
• Schottky Barrier Diodes (SBDs)
• Rectifier Diodes
• Zener Diodes
Test Service
Amkor offers full turnkey business for all power discrete products. We have
the capability to test various type of power devices including MOSFETs,
bipolar transistors, IGBTs, diodes, regulator ICs/intelligent power devices, etc.
• Amkor power discrete test capability:
– Static test (DC)
– Dynamic test (AC, Switching/Trr, Capacitance/Rg)
– Destruction test (Inductive load/VSUS, I Latch, Surge, Isolation/VIL)
–
Thermal Resistance (ΔVDS, ΔmV, etc.)
• Program generation/conversion
• Failure analysis
• Available test/handling technology
• Integrated marking, vision inspection and tape & reel services
Features
• Cu connector structure to reduce inductance and
resistance
• Enhance thermal property
• Turnkey with test and packing services
• Green materials: Pb-free plating & halogen-free mold
compound
New Developments
• Larger/higher density leadframe strips
• Environmentally friendly Pb-free solder paste
Visit Amkor Technology online for locations and
to view the most current product information.
DS615A
Rev Date: 5-14
Questions? Contact us: marketing@amkor.com
Data Sheet
SOD323-FL
Shipping
• Tape and reel packing
– 4000 pcs per reel
– Tape width 8 mm
–
Reel Ф = 180 mm
• Barcode packing label
• Drop ship
POWER DISCRETE
Cross-section SOD323-FL
Package Outline Drawing SOD323-FL
Visit Amkor Technology online for locations and
to view the most current product information.
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not
be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s
warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name
and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2014, Amkor Technology Incorporated. All Rights Reserved.
DS615A
Rev Date: 5-14
Questions? Contact us: marketing@amkor.com
Analogue and Mixed Signal
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