Data Sheet
SO8-FL
Process Highlights
POWER DISCRETE
Introduction
SO8-FL (Flat Lead) is a thinner and thermally enhanced
package, improving power dissipation capability by 47%,
while maintaining the same footprint area (5 x 6 mm) as
standard SOIC 8 ld package.
This package may also be know as:
• SOP-Adv
• PowerFLAT 5x6™
• TDSON
• HVSON
• JEDEC MO240 AA
• Bare copper leadframe with no plating
• Die attach: 55 um thin die pick up capability
• Interconnect: Cu clips technology for better electrical and thermal
performance. Also available on Al strap + wire option.
• Plating: 100% matte Sn
• Marking: Pen type laser
Standard Materials
• Leadframe: Bare copper
• Die attach: Solder paste*
• Interconnect: 2 option,
– Dual Cu clips
– Al strap + wire 1.5 mil Cu
• Mold compound: Halogen free
*Apply to option dual Cu clips.
Application
SO8-FL is suitable for medium-power applications, designed
for low on-resistance and high-speed-switching MOSFETs:
• Battery protection circuits
• Notebook PCs
• Portable electronic devices
• DC-DC converters
Reliability Qualification
Amkor devices are assembled with proven reliable semiconductor materials.
• All test include pre-condition of: Ta = 85°C/Rh = 85%, 72 hrs with IR reflow
Ta = 265°C, 3X
• High Temperature Storage, Ta = 150°C, 1000 hrs
• Pressure Cooker, Ta = 121°C/Rh = 100%/P = 2 atm, 96 hrs
• Temperature Cycle, -65~150°C, 300 cycles
Features
• Thin and thermally enhanced package with the same size
as SOIC 8 ld
• Dual Cu Clip interconnect for better heat dissipation
efficiency
• Al strap + wire option is also available
• Turnkey with test and packing services
• Green materials: Pb-free plating & halogen free mold
compound
Test Service
Amkor offers full turnkey business for all power discrete products. We have
the capability to test various type of power devices including MOSFETs,
bipolar transistors, IGBTs, diodes, regulator ICs/intelligent power devices, etc.
• Amkor power discrete test capability:
– Static test (DC)
– Dynamic test (AC, Switching/Trr, Capacitance/Rg)
– Destruction test (Inductive load/VSUS, I Latch, Surge, Isolation/VIL)
–
Thermal Resistance (ΔVDS, ΔmV, etc.)
• Program generation/conversion
• Failure analysis
• Available test/handling technology
• Integrated marking, vision inspection and tape & reel services
New Developments
•
•
•
•
Dual exposed pad for better thermal performance
Thin wafer dicing with narrow saw streets
Larger/higher density leadframe strips
Environmentally friendly Pb-free solder paste
Visit Amkor Technology online for locations and
to view the most current product information.
DS611A
Rev Date: 5-14
Questions? Contact us: marketing@amkor.com
Data Sheet
SO8-FL
Shipping
• Tape and reel packing
– 3000 pcs or 5000 pcs per reel
– Tape width 12 mm
–
Reel Ф = 330 mm
• Barcode packing label
• Drop ship
POWER DISCRETE
Cross-section
–
Option 1: Al Strap + Wire
Cross-section
–
Option 2: Dual Cu Clip
Package Outline Drawing SO8-FL
Visit Amkor Technology online for locations and
to view the most current product information.
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not
be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s
warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. The Amkor name
and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respective companies. © 2014, Amkor Technology Incorporated. All Rights Reserved.
DS611A
Rev Date: 5-14
Questions? Contact us: marketing@amkor.com
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