Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BSZ050N03MS G
MA000896758
PG-TSDSON-8-22
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
tin
lead
phosphorus
zinc
iron
copper
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7440-66-6
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
1.213
0.004
0.014
0.283
11.505
0.187
0.036
1.878
16.315
0.370
0.081
0.069
1.312
0.001
0.004
0.078
3.182
Average
Mass
[%]
3.32
0.01
0.04
0.78
31.49
0.51
0.10
5.14
44.67
1.01
0.22
0.19
3.59
0.00
0.01
0.21
8.71
29. August 2013
36.53 mg
Sum
[%]
3.32
Average
Mass
[ppm]
33190
97
388
7756
32.32
0.51
314923
5130
998
51396
49.91
1.01
0.22
446602
10130
2212
1890
3.78
35914
27
107
2145
8.93
87095
89374
1000000
37804
498996
10130
2212
323164
5130
Sum
[ppm]
33190
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
< 10%
leadfinish
plating
solder
heat sink CLIP
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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