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SGL40N150

Description
General Description
CategoryDiscrete semiconductor    The transistor   
File Size350KB,7 Pages
ManufacturerFairchild
Websitehttp://www.fairchildsemi.com/
Download Datasheet Parametric View All

SGL40N150 Overview

General Description

SGL40N150 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerFairchild
Parts packaging codeTO-264AA
package instructionFLANGE MOUNT, R-PSFM-T3
Contacts3
Reach Compliance Codeunknow
Other featuresLOW CONDUCTION LOSS, HIGH SPEED SWITCHING
Maximum collector current (IC)40 A
Collector-emitter maximum voltage1500 V
ConfigurationSINGLE
Maximum landing time (tf)400 ns
Gate emitter threshold voltage maximum7.5 V
Gate-emitter maximum voltage25 V
JEDEC-95 codeTO-264AA
JESD-30 codeR-PSFM-T3
JESD-609 codee0
Number of components1
Number of terminals3
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeN-CHANNEL
Maximum power dissipation(Abs)200 W
Certification statusNot Qualified
Maximum rise time (tr)1000 ns
surface mountNO
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED
transistor applicationsPOWER CONTROL
Transistor component materialsSILICON
Nominal off time (toff)475 ns
Nominal on time (ton)320 ns
Base Number Matches1
SGL40N150
IGBT
SGL40N150
General Description
Fairchild’s Insulated Gate Bipolar Transistor
(IGBT)
provides low conduction and switching losses.
The SGL40N150 is designed for induction heating
applications.
Features
• High speed switching
• Low saturation voltage : V
CE(sat)
= 3.7 V @ I
C
= 40A
• High input impedance
Applications
Home appliances, induction heaters, IH JAR, and microwave ovens.
C
G
TO-264
G
C
E
T
C
= 25°C unless otherwise noted
E
Absolute Maximum Ratings
Symbol
V
CES
V
GES
I
C
I
CM (1)
P
D
T
J
T
stg
T
L
Description
Collector-Emitter Voltage
Gate-Emitter Voltage
Collector Current
Collector Current
Pulsed Collector Current
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction Temperature
Storage Temperature Range
Maximum Lead Temp. for Soldering
Purposes, 1/8” from Case for 5 Seconds
@ T
C
= 25°C
@ T
C
= 100°C
@ T
C
= 25°C
@ T
C
= 100°C
SGL40N150
1500
±
25
40
20
120
200
80
-55 to +150
-55 to +150
300
Units
V
V
A
A
A
W
W
°C
°C
°C
Notes :
(1) Repetitive rating : Pulse width limited by max. junction temperature
Thermal Characteristics
Symbol
R
θJC
(IGBT)
R
θJA
Parameter
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient
Typ.
--
--
Max.
0.625
25
Units
°C/W
°C/W
©2002 Fairchild Semiconductor Corporation
SGL40N150 Rev. A1

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