MM2758AQ1 datasheet, PDF - EEWORLD Datasheet

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MM2758AQ1: DescriptionIC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC; Categorystorage storage; File Size444KB，6 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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MM2758AQ1 Overview

IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC

MM2758AQ1 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	1435210764
package instruction	DIP, DIP24,.6
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	350 ns
I/O type	COMMON
JESD-30 code	R-XDIP-T24
JESD-609 code	e0
memory density	8192 bit
Memory IC Type	OTP ROM
memory width	8
Number of terminals	24
word count	1024 words
character code	1000
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1KX8
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
surface mount	NO
technology	MOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

MM2758AQ1 Related Products

	MM2758AQ1	MM2758AQ	MM2758BQ	MM2758BQ1
Description	IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC	IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC	IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC	IC,EPROM,1KX8,MOS,DIP,24PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Objectid	1435210764	1435210770	1435210782	1435210776
package instruction	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6	DIP, DIP24,.6
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99
Maximum access time	350 ns	450 ns	450 ns	350 ns
I/O type	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24	R-XDIP-T24
JESD-609 code	e0	e0	e0	e0
memory density	8192 bit	8192 bit	8192 bit	8192 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8
Number of terminals	24	24	24	24
word count	1024 words	1024 words	1024 words	1024 words
character code	1000	1000	1000	1000
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	1KX8	1KX8	1KX8	1KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP24,.6	DIP24,.6	DIP24,.6	DIP24,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO
technology	MOS	MOS	MOS	MOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL

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