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TYC0402C123ZET

Description
CAPACITOR, CERAMIC, MULTILAYER, 16V, X5R, 0.012uF, SURFACE MOUNT, 0402, CHIP, ROHS COMPLIANT
CategoryPassive components    capacitor   
File Size330KB,8 Pages
ManufacturerTE Connectivity
Websitehttp://www.te.com
Environmental Compliance
Download Datasheet Parametric View All

TYC0402C123ZET Overview

CAPACITOR, CERAMIC, MULTILAYER, 16V, X5R, 0.012uF, SURFACE MOUNT, 0402, CHIP, ROHS COMPLIANT

TYC0402C123ZET Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid1635756474
package instruction, 0402
Reach Compliance Codeunknown
ECCN codeEAR99
capacitance0.012 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance20%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
positive tolerance80%
Rated (DC) voltage (URdc)16 V
size code0402
surface mountYES
Temperature characteristic codeX5R
Temperature Coefficient15% ppm/°C
Terminal shapeWRAPAROUND
Multilayer Ceramic Chip Capacitor
Type TYC Series
Key Features
I
I
I
I
I
I
I
I
I
Choice of Dielectrics
(NP0, X7R, X5R, Y5V)
0402 to 1812 sizes as
standard
Other sizes available.
0201 available soon
6.3V to 50V in standard
range
Voltage ratings to 3kV
on selected products
Range of tolerances
available
RoHS Compliant
Excellent thermal stability
Low dissipation factor
Multilayer ceramic capacitors (MLCC) are manufactured by suspending ceramic powders in
liquid and casting into a thin green sheet from 20mm in thickness to 5mm or thinner.
Metal electrodes are sieved printed onto green sheets, which are later stacked to form a
laminated structure. The metal electrodes are arranged so that the termination alternates from
one edge to another of the capacitor.
Upon sintering at high temperature the part becomes a monolithic block, which can provide
an extremely high capacitance in small mechanical volumes.
Finally, the termination electrodes are formed by composite of outer metal-glass electrode and
followed by a barrier layer and pure-tin plating to permit MLCC to be soldered directly onto
printed circuit board.
Structure
End Termination
(4)
(5)
(3)
Ceramic
(1) Dielectric
(2) Internal
Electrode
Class 1
No
1
2
3
4
5
End Terminal
End Terminal
Specifications
Ceramic dielectric
Internal Electrode
Inner Layer
Middle Layer
Outer Layer
Material
Barium titanate base
Pb, PdAg
Ag
Ni
Sn
Class 2
No
1
2
3
4
5
End Terminal
End Terminal
Internal Electrode
Inner Layer
Middle Layer
Outer Layer
Specifications
Ceramic dielectric
Pb, PbAg
Ag
Ni
Sn
Material
Barium titanate base
Ni
Cu
1773291 CIS BI 06/2011
Dimensions are in millimeters
and inches unless otherwise
specified. Values in brackets
are standard equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
For email, phone or live chat, go to:
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