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C527UT230-0101

Description
UltraThin LEDs
File Size239KB,5 Pages
ManufacturerCree
Websitehttp://www.cree.com/
Download Datasheet View All

C527UT230-0101 Overview

UltraThin LEDs

UltraThin™ LEDs
CxxxUT230-S0002
Cree’s UltraThin LEDs combine highly efficient InGaN materials with Cree’s proprietary G•SiC
®
substrate to deliver
superior price/performance for blue and green LEDs. These vertically structured LED chips are small in size and
require a low forward voltage. Cree’s UT™ series chips are tested for conformity to optical and electrical specifications
and the ability to withstand 1000 V ESD. Applications include keypad backlighting where sub-miniaturization and
thinner form factors are required.
FEATURES
Small Chip – 230 x 230 x 85 μm
UT LED Performance
5.5 mW min. (455–475 nm) Blue
2.5 mW min. (500-510 nm) Traffic Green
2.5 mW min. (520-535 nm) Green
APPLICATIONS
Mobile Phone Keypads
Audio Product Display Lighting
Mobile Appliance Keypads
Automotive Applications
Low Forward Voltage
2.9–3.0 V Typical at 5 mA
Single Wire Bond Structure
Class 2 ESD Rating
CxxxUT230-S0002 Chip Diagram
Top View
G•SiC LED Chip
230 x 230 μm
Mesa (junction)
176 x 176 μm
Gold Bond Pad
105 μm Diameter
Bottom View
SiC Substrate
Bottom Surface
150 x 150 μm
SiC Substrate
h = 85 μm
Backside
Metallization
80 x 80 μm
Die Cross Section
InGaN
Anode (+)
.E
CPR3CD Rev
Data Sheet:
Cathode (-)
Subject to change without notice.
www.cree.com

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