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HPCSIP-2X08-018B

Description
IC Socket, DIP16, 16 Contact(s), 2.54mm Term Pitch , 0.1inch Row Spacing, Solder
CategoryThe connector    socket   
File Size454KB,5 Pages
ManufacturerAmphenol
Websitehttp://www.amphenol.com/
Download Datasheet Parametric View All

HPCSIP-2X08-018B Overview

IC Socket, DIP16, 16 Contact(s), 2.54mm Term Pitch , 0.1inch Row Spacing, Solder

HPCSIP-2X08-018B Parametric

Parameter NameAttribute value
Objectid1153515469
Reach Compliance Codecompliant
ECCN codeEAR99
body width0.2 inch
subject depth0.165 inch
body length0.8 inch
Contact to complete cooperationSN ON NI
Contact completed and terminatedGOLD
Contact materialBE-CU
Contact styleRND PIN-SKT
current rating3 A
Device slot typeIC SOCKET
Type of equipment usedDIP16
Dielectric withstand voltage1000VAC V
Shell materialTHERMOPLASTIC
Insulation resistance10000000000 Ω
Manufacturer's serial numberHPC
Plug contact pitch0.1 inch
Installation methodSTRAIGHT
Number of contacts16
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
PCB contact patternRECTANGULAR
PCB contact row spacing0.1 mm
Terminal pitch2.54 mm
Termination typeSOLDER

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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