Flash, 512KX8, 70ns, PQCC32, PLASTIC, MS-016, LCC-32
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Objectid | 1125520508 |
package instruction | QCCJ, LDCC32,.5X.6 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 70 ns |
command user interface | YES |
Universal Flash Interface | YES |
Data polling | YES |
JESD-30 code | R-PQCC-J32 |
length | 14.05 mm |
memory density | 4194304 bit |
Memory IC Type | FLASH |
memory width | 8 |
Humidity sensitivity level | 1 |
Number of functions | 1 |
Number of departments/size | 8 |
Number of terminals | 32 |
word count | 524288 words |
character code | 512000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 512KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC32,.5X.6 |
Package shape | RECTANGULAR |
Package form | CHIP CARRIER |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 225 |
power supply | 3/3.3 V |
Programming voltage | 3 V |
Certification status | Not Qualified |
Maximum seat height | 3.55 mm |
Department size | 64K |
Maximum standby current | 0.000005 A |
Maximum slew rate | 0.03 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
switch bit | YES |
type | NOR TYPE |
width | 11.43 mm |
KH29LV040CQC-70 | KH29LV040CQC-70G | KH29LV040CQC-90G | KH29LV040CQC-90 | |
---|---|---|---|---|
Description | Flash, 512KX8, 70ns, PQCC32, PLASTIC, MS-016, LCC-32 | Flash, 512KX8, 70ns, PQCC32, ROHS COMPLIANT, PLASTIC, MS-016, LCC-32 | Flash, 512KX8, 90ns, PQCC32, ROHS COMPLIANT, PLASTIC, MS-016, LCC-32 | Flash, 512KX8, 90ns, PQCC32, PLASTIC, MS-016, LCC-32 |
Is it Rohs certified? | incompatible | conform to | conform to | incompatible |
Objectid | 1125520508 | 1125520507 | 1125520509 | 1125520510 |
package instruction | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 70 ns | 70 ns | 90 ns | 90 ns |
command user interface | YES | YES | YES | YES |
Universal Flash Interface | YES | YES | YES | YES |
Data polling | YES | YES | YES | YES |
JESD-30 code | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 | R-PQCC-J32 |
length | 14.05 mm | 14.05 mm | 14.05 mm | 14.05 mm |
memory density | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
Memory IC Type | FLASH | FLASH | FLASH | FLASH |
memory width | 8 | 8 | 8 | 8 |
Humidity sensitivity level | 1 | 1 | 1 | 1 |
Number of functions | 1 | 1 | 1 | 1 |
Number of departments/size | 8 | 8 | 8 | 8 |
Number of terminals | 32 | 32 | 32 | 32 |
word count | 524288 words | 524288 words | 524288 words | 524288 words |
character code | 512000 | 512000 | 512000 | 512000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QCCJ | QCCJ | QCCJ | QCCJ |
Encapsulate equivalent code | LDCC32,.5X.6 | LDCC32,.5X.6 | LDCC32,.5X.6 | LDCC32,.5X.6 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | 225 | 225 | 225 | 225 |
power supply | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V |
Programming voltage | 3 V | 3 V | 3 V | 3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 3.55 mm | 3.55 mm | 3.55 mm | 3.55 mm |
Department size | 64K | 64K | 64K | 64K |
Maximum standby current | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A |
Maximum slew rate | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
Nominal supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V |
surface mount | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | J BEND | J BEND | J BEND | J BEND |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | QUAD | QUAD | QUAD | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
switch bit | YES | YES | YES | YES |
type | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
width | 11.43 mm | 11.43 mm | 11.43 mm | 11.43 mm |