EEWORLDEEWORLDEEWORLD

Part Number

Search

M55342E10B442BT-W

Description
Fixed Resistor, Thin Film, 0.5W, 442000ohm, 75V, 0.1% +/-Tol, 25ppm/Cel, Surface Mount, 1010, CHIP
CategoryPassive components    The resistor   
File Size106KB,1 Pages
ManufacturerState of the Art Inc.
Download Datasheet Parametric View All

M55342E10B442BT-W Overview

Fixed Resistor, Thin Film, 0.5W, 442000ohm, 75V, 0.1% +/-Tol, 25ppm/Cel, Surface Mount, 1010, CHIP

M55342E10B442BT-W Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid1969477547
package instructionCHIP
Reach Compliance Codenot_compliant
Other featuresPRECISION
JESD-609 codee0
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Package shapeRECTANGULAR PACKAGE
method of packingWAFFLE PACK
Rated power dissipation(P)0.5 W
Rated temperature70 °C
GuidelineMIL-PRF-55342
resistance442000 Ω
Resistor typeFIXED RESISTOR
size code1010
surface mountYES
technologyTHIN FILM
Temperature Coefficient25 ppm/°C
Terminal surfaceTin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance0.1%
Operating Voltage75 V
State of the Art, Inc.
Thin Film Chip Resistor
M55342/10 RM1010
PROTECTIVE
ENCAPSULANT
PRECISION
THIN FILM
RESISTOR
99.6% ALUMINA CHIP
WRAPAROUND
TERMINATIONS
PRETINNED
PERFORMANCE
TEMPERATURE RISE (°C)
Resistance Range
Tolerances
Maximum Power
Maximum Voltage
100
W
- 1M
W
0.1%, 1%, 2%, 5%
500 mW
75 Volts
CURRENT NOISE
POWER DISSIPATION
fiber epoxy board
ceramic board
TESTS
TCR (-55 to +125
°
C) in ppm/
°
C
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Soldering Heat
Moisture Resistance
Life, 2,000 Hours (qualification)
High Temperature Exposure
CHARACTERISTICS*
H
E
±25
±0.1%
±0.1%
±0.1%
±0.2%
±0.2%
±0.5%
±0.1%
±50
±0.25%
±0.25%
±0.1%
±0.25%
±0.4%
±0.5%
±0.2%
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
*Maximum allowable change per MIL-PRF-55342,
typical change is 10% of these values.
PART NUMBERING
M55342 H 10 B 100D R - TR
PACKAGING CODE: TR = Tape & Reel W= Waffle Pack
PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% T: Space Level C: Non - ER
RESISTANCE AND TOLERANCE CODE:
Three significant digits, with a letter indicating the
decimal location, the tolerance, and the value range.
TERMINATION MATERIALS:
SIZE CODE: /10 = RM1010
TEMPERATURE CHARACTERISTIC: E: ± 25ppm H: ± 50ppm
PERFORMANCE SPECIFICATION MIL-PRF-55342
B: Solderable wraparound
A: 0.1%
W
D: 1%
W
G: 2%
W
J: 5%
W
B: 0.1% K
W
E: 1% K
W
H: 2% K
W
K: 5% K
W
C: 0.1% M
W
F: 1% M
W
T: 2% M
W
L: 5% M
W
W: Gold wire bondable
MECHANICAL
INCHES
MILLIMETERS
.131
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.101 (.098 - .112)
.095 (.095 - .105)
.018 (.015 - .033)
.015 (.010 - .020)
.015 (.010 - .020)
.071 (.067 - .075)
.0105 grams
2.57
2.41
0.46
0.38
0.38
1.80
(2.49 - 2.84)
(2.41 - 2.67)
(0.38 - 0.84)
(0.25 - 0.51)
(0.25 - 0.51)
(1.70 - 1.91)
.101
.065
.033
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401
“Specifications subject to change without notice.”
www.resistor.com
04/09/08
What are the causes of PCB board welding defects?
What are the causes of PCB board welding defects? In order to ensure the overall quality of PCB boards, excellent solder should be used during the production process to improve the solderability of PC...
就某个水呀 PCB Design
Implementation of TCP/IP Protocol Stack on TI C6000DSP
TI has launched the TCP/IP NDK (Network Developer's Kit) development kit in conjunction with the C6000 chip. Its main components include: (1) Program libraries supporting the TCP/IP protocol stack. Th...
Jacktang DSP and ARM Processors
Instruction cycle - machine cycle - state cycle - clock cycle, is Baidu's answer correct?
Instruction cycle - machine cycle - state cycle - clock cycle, is Baidu's answer correct?...
QWE4562009 Integrated technical exchanges
CC430 Wireless Development Tools
DescriptionTheEM430F6147RF900 is a complete wireless development kit for CC430 that contains all the hardware needed to develop a complete wireless project.The sample kit contains two sub-1GHz wireles...
Jacktang Wireless Connectivity
Problems with HVC4223FB6 alternatives
I recently took over a project, and the company bought someone else's product, the chip is HVC4223FB6, 40 pins. I checked and found that it was from a German micro-opening company, and there is not mu...
chenbingjy 51mcu
TIC66XX series DSP——C6678
C6678 is a multi-core processor (8 C66XX cores), each core has its own independent 32KB LIP, 32KB L1D and 512KB L2. In addition, the 8 cores have a 4M shared MSM. Interface resources include SRIO, PCI...
fish001 DSP and ARM Processors

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号