|
7M4042S80CB |
7M4042S65CB |
Description |
Standard SRAM, 256KX4, 80ns, CMOS, CDIP28, 1.600 X 0.400 INCH, 0.280 INCH HEIGHT, CERAMIC, SIDEBRAZED, DIP-28 |
Standard SRAM, 256KX4, 65ns, CMOS, CDIP28, 1.600 X 0.400 INCH, 0.280 INCH HEIGHT, CERAMIC, SIDEBRAZED, DIP-28 |
Is it lead-free? |
Contains lead |
Contains lead |
Is it Rohs certified? |
incompatible |
incompatible |
Objectid |
1164070767 |
1164070765 |
package instruction |
DIP, DIP28,.4 |
DIP, DIP28,.4 |
Reach Compliance Code |
not_compliant |
not_compliant |
ECCN code |
3A001.A.2.C |
3A001.A.2.C |
Maximum access time |
80 ns |
65 ns |
I/O type |
COMMON |
COMMON |
JESD-30 code |
R-CDIP-T28 |
R-CDIP-T28 |
JESD-609 code |
e0 |
e0 |
memory density |
1048576 bit |
1048576 bit |
Memory IC Type |
STANDARD SRAM |
STANDARD SRAM |
memory width |
4 |
4 |
Number of functions |
1 |
1 |
Number of terminals |
28 |
28 |
word count |
262144 words |
262144 words |
character code |
256000 |
256000 |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
Maximum operating temperature |
125 °C |
125 °C |
Minimum operating temperature |
-55 °C |
-55 °C |
organize |
256KX4 |
256KX4 |
Output characteristics |
3-STATE |
3-STATE |
Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
encapsulated code |
DIP |
DIP |
Encapsulate equivalent code |
DIP28,.4 |
DIP28,.4 |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
IN-LINE |
IN-LINE |
Parallel/Serial |
PARALLEL |
PARALLEL |
Peak Reflow Temperature (Celsius) |
225 |
225 |
power supply |
5 V |
5 V |
Certification status |
Not Qualified |
Not Qualified |
Filter level |
MIL-STD-883 Class B |
MIL-STD-883 Class B |
Maximum standby current |
0.122 A |
0.122 A |
Minimum standby current |
4.5 V |
4.5 V |
Maximum slew rate |
0.32 mA |
0.32 mA |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
surface mount |
NO |
NO |
technology |
CMOS |
CMOS |
Temperature level |
MILITARY |
MILITARY |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
Terminal pitch |
2.54 mm |
2.54 mm |
Terminal location |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
30 |
30 |