Standard SRAM, 32KX8, 25ns, CMOS, PDSO28
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Objectid | 101243170 |
Parts packaging code | SOJ |
package instruction | SOJ, SOJ28,.34 |
Contacts | 28 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum access time | 25 ns |
I/O type | COMMON |
JESD-30 code | R-PDSO-J28 |
JESD-609 code | e0 |
memory density | 262144 bit |
Memory IC Type | STANDARD SRAM |
memory width | 8 |
Number of terminals | 28 |
word count | 32768 words |
character code | 32000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 32KX8 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOJ |
Encapsulate equivalent code | SOJ28,.34 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Maximum standby current | 0.005 A |
Minimum standby current | 4.5 V |
Maximum slew rate | 0.13 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
MB8298-25PJ | MB8298-25P-SK | |
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Description | Standard SRAM, 32KX8, 25ns, CMOS, PDSO28 | Standard SRAM, 32KX8, 25ns, CMOS, PDIP28, |
Is it Rohs certified? | incompatible | incompatible |
package instruction | SOJ, SOJ28,.34 | DIP, DIP28,.3 |
Reach Compliance Code | compliant | compliant |
Maximum access time | 25 ns | 25 ns |
I/O type | COMMON | COMMON |
JESD-30 code | R-PDSO-J28 | R-PDIP-T28 |
JESD-609 code | e0 | e0 |
memory density | 262144 bit | 262144 bit |
Memory IC Type | STANDARD SRAM | STANDARD SRAM |
memory width | 8 | 8 |
Number of terminals | 28 | 28 |
word count | 32768 words | 32768 words |
character code | 32000 | 32000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C |
organize | 32KX8 | 32KX8 |
Output characteristics | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOJ | DIP |
Encapsulate equivalent code | SOJ28,.34 | DIP28,.3 |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | IN-LINE |
Parallel/Serial | PARALLEL | PARALLEL |
power supply | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified |
Maximum standby current | 0.005 A | 0.005 A |
Minimum standby current | 4.5 V | 4.5 V |
Maximum slew rate | 0.13 mA | 0.13 mA |
Nominal supply voltage (Vsup) | 5 V | 5 V |
surface mount | YES | NO |
technology | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | J BEND | THROUGH-HOLE |
Terminal pitch | 1.27 mm | 2.54 mm |
Terminal location | DUAL | DUAL |