SRAM Module, 512KX8, 100ns, CMOS, PDIP32
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Objectid | 101271671 |
package instruction | DIP, DIP32,.6 |
Reach Compliance Code | unknown |
ECCN code | 3A991.B.2.A |
Maximum access time | 100 ns |
I/O type | COMMON |
JESD-30 code | R-PDIP-T32 |
JESD-609 code | e0 |
memory density | 4194304 bit |
Memory IC Type | SRAM MODULE |
memory width | 8 |
Number of terminals | 32 |
word count | 524288 words |
character code | 512000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 512KX8 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP32,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Maximum standby current | 0.00034 A |
Minimum standby current | 2 V |
Maximum slew rate | 0.11 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
DPS512S8PT-10I | DPS512S8PT-10C | DPS512S8PT-85I | DPS512S8PT-12C | DPS512S8PT-12I | |
---|---|---|---|---|---|
Description | SRAM Module, 512KX8, 100ns, CMOS, PDIP32 | SRAM Module, 512KX8, 100ns, CMOS, PDIP32 | SRAM Module, 512KX8, 85ns, CMOS, PDIP32 | SRAM Module, 512KX8, 120ns, CMOS, PDIP32 | SRAM Module, 512KX8, 120ns, CMOS, PDIP32 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
Objectid | 101271671 | 101271502 | 101271652 | 101271548 | 101271689 |
package instruction | DIP, DIP32,.6 | DIP, DIP32,.6 | DIP, DIP32,.6 | DIP, DIP32,.6 | DIP, DIP32,.6 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
Maximum access time | 100 ns | 100 ns | 85 ns | 120 ns | 120 ns |
I/O type | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-PDIP-T32 | R-PDIP-T32 | R-PDIP-T32 | R-PDIP-T32 | R-PDIP-T32 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 |
memory density | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
Memory IC Type | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
memory width | 8 | 8 | 8 | 8 | 8 |
Number of terminals | 32 | 32 | 32 | 32 | 32 |
word count | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
character code | 512000 | 512000 | 512000 | 512000 | 512000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C |
Minimum operating temperature | -40 °C | - | -40 °C | - | -40 °C |
organize | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP32,.6 | DIP32,.6 | DIP32,.6 | DIP32,.6 | DIP32,.6 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum standby current | 0.00034 A | 0.00018 A | 0.00034 A | 0.00018 A | 0.00034 A |
Minimum standby current | 2 V | 2 V | 2 V | 2 V | 2 V |
Maximum slew rate | 0.11 mA | 0.11 mA | 0.11 mA | 0.11 mA | 0.11 mA |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |