|
TMS320LC549GGU-66 |
TMS320LC549GGUR-80 |
TMS320LC549PGE-80 |
TMS320LC549GGU-80 |
TMS320LC549PGE-66 |
Description |
Digital Signal Processors & Controllers - DSP, DSC Dig Signal Proc |
Digital Signal Processors & Controllers - DSP, DSC Dig Sig Processor |
Digital Signal Processor 144-LQFP |
Digital Signal Processors & Controllers - DSP, DSC Dig Signal Proc |
Digital Signal Processor 144-LQFP |
Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Is it Rohs certified? |
incompatible |
incompatible |
conform to |
incompatible |
conform to |
Parts packaging code |
BGA |
BGA |
QFP |
BGA |
QFP |
package instruction |
LFBGA, BGA144,13X13,32 |
LFBGA, BGA144,13X13,32 |
LFQFP, QFP144,.87SQ,20 |
LFBGA, BGA144,13X13,32 |
LFQFP, QFP144,.87SQ,20 |
Contacts |
144 |
144 |
144 |
144 |
144 |
Reach Compliance Code |
_compli |
_compli |
compli |
_compli |
compli |
Address bus width |
23 |
23 |
23 |
23 |
23 |
barrel shifter |
YES |
YES |
YES |
YES |
YES |
bit size |
16 |
16 |
16 |
16 |
16 |
boundary scan |
YES |
YES |
YES |
YES |
YES |
maximum clock frequency |
20 MHz |
20 MHz |
20 MHz |
20 MHz |
20 MHz |
External data bus width |
16 |
16 |
16 |
16 |
16 |
Format |
FIXED POINT |
FIXED POINT |
FIXED POINT |
FIXED POINT |
FIXED POINT |
Internal bus architecture |
MULTIPLE |
MULTIPLE |
MULTIPLE |
MULTIPLE |
MULTIPLE |
JESD-30 code |
S-PBGA-B144 |
S-PBGA-B144 |
S-PQFP-G144 |
S-PBGA-B144 |
S-PQFP-G144 |
length |
12 mm |
12 mm |
20 mm |
12 mm |
20 mm |
low power mode |
YES |
YES |
YES |
YES |
YES |
Number of terminals |
144 |
144 |
144 |
144 |
144 |
Maximum operating temperature |
100 °C |
100 °C |
100 °C |
100 °C |
100 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
LFBGA |
LFBGA |
LFQFP |
LFBGA |
LFQFP |
Encapsulate equivalent code |
BGA144,13X13,32 |
BGA144,13X13,32 |
QFP144,.87SQ,20 |
BGA144,13X13,32 |
QFP144,.87SQ,20 |
Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
Package form |
GRID ARRAY, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
260 |
NOT SPECIFIED |
260 |
power supply |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
RAM (number of words) |
32768 |
65536 |
32768 |
32768 |
32768 |
Maximum seat height |
1.4 mm |
1.4 mm |
1.6 mm |
1.4 mm |
1.6 mm |
Maximum supply voltage |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
3.6 V |
Minimum supply voltage |
3 V |
3 V |
3 V |
3 V |
3 V |
Nominal supply voltage |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
BALL |
BALL |
GULL WING |
BALL |
GULL WING |
Terminal pitch |
0.8 mm |
0.8 mm |
0.5 mm |
0.8 mm |
0.5 mm |
Terminal location |
BOTTOM |
BOTTOM |
QUAD |
BOTTOM |
QUAD |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
12 mm |
12 mm |
20 mm |
12 mm |
20 mm |
uPs/uCs/peripheral integrated circuit type |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |
Is it lead-free? |
Contains lead |
Contains lead |
- |
Contains lead |
- |
Base Number Matches |
- |
- |
1 |
1 |
1 |