OTP ROM, 8KX8, 100ns, TTL, CQCC28
Parameter Name | Attribute value |
Objectid | 1436055398 |
package instruction | QCCN, LCC28,.45SQ |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 100 ns |
JESD-30 code | S-XQCC-N28 |
memory density | 65536 bit |
Memory IC Type | OTP ROM |
memory width | 8 |
Number of terminals | 28 |
word count | 8192 words |
character code | 8000 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 8KX8 |
Package body material | CERAMIC |
encapsulated code | QCCN |
Encapsulate equivalent code | LCC28,.45SQ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
power supply | 5 V |
Certification status | Not Qualified |
Filter level | 38535Q/M;38534H;883B |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | TTL |
Temperature level | MILITARY |
Terminal form | NO LEAD |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
82009D13X | |
---|---|
Description | OTP ROM, 8KX8, 100ns, TTL, CQCC28 |
Objectid | 1436055398 |
package instruction | QCCN, LCC28,.45SQ |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 100 ns |
JESD-30 code | S-XQCC-N28 |
memory density | 65536 bit |
Memory IC Type | OTP ROM |
memory width | 8 |
Number of terminals | 28 |
word count | 8192 words |
character code | 8000 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 8KX8 |
Package body material | CERAMIC |
encapsulated code | QCCN |
Encapsulate equivalent code | LCC28,.45SQ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
power supply | 5 V |
Certification status | Not Qualified |
Filter level | 38535Q/M;38534H;883B |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | TTL |
Temperature level | MILITARY |
Terminal form | NO LEAD |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |