EEPROM, 32KX8, 100ns, Parallel, CMOS, CQCC32, LCC-32
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Objectid | 1154965784 |
package instruction | QCCJ, LDCC32,.45X.7 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 100 ns |
Other features | LG-MAX; WD-MAX; SEATED HGT NOMINAL |
command user interface | NO |
Data polling | YES |
Durability | 10000 Write/Erase Cycles |
JESD-30 code | R-CQCC-J32 |
JESD-609 code | e0 |
length | 14.42 mm |
memory density | 262144 bit |
Memory IC Type | EEPROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 32768 words |
character code | 32000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 32KX8 |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC32,.45X.7 |
Package shape | RECTANGULAR |
Package form | CHIP CARRIER |
page size | 64 words |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Programming voltage | 5 V |
Certification status | Not Qualified |
Maximum seat height | 4.32 mm |
Maximum standby current | 0.06 A |
Maximum slew rate | 0.08 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
switch bit | YES |
width | 11.68 mm |
Maximum write cycle time (tWC) | 12 ms |