M55342K10B102ET-W datasheet, PDF

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M55342K10B102ET-W: DescriptionFixed Resistor, Metal Glaze/thick Film, 0.5W, 102000ohm, 75V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1010, CHIP; CategoryPassive components The resistor; File Size1MB，1 Pages; ManufacturerState of the Art Inc.

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M55342K10B102ET-W Overview

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 102000ohm, 75V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1010, CHIP

M55342K10B102ET-W Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Objectid	1968961386
package instruction	CHIP
Reach Compliance Code	not_compliant
Other features	SEMI PRECISION
structure	Chip
JESD-609 code	e0
Installation features	SURFACE MOUNT
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-65 °C
Package height	0.46 mm
Package length	2.57 mm
Package shape	RECTANGULAR PACKAGE
Package form	SMT
Package width	2.41 mm
method of packing	WAFFLE TRAY
Rated power dissipation(P)	0.5 W
Rated temperature	70 °C
Guideline	MIL-PRF-55342/10
resistance	102000 Ω
Resistor type	FIXED RESISTOR
size code	1010
surface mount	YES
technology	METAL GLAZE/THICK FILM
Temperature Coefficient	100 ppm/°C
Terminal surface	Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Terminal shape	WRAPAROUND
Tolerance	1%
Operating Voltage	75 V

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State of the Art, Inc.

Semi-Precision Thick Film Chip Resistor

MIL-PRF-55342/10 Solderable RM1010

1Ω to 22 MΩ

1, 2, 5, 10

100, 200, 300

500 mW

75 V

-65 to 150°C

M, P, R, S, U, V, T

Noise

Performance

Resistance Range*

Tolerances (± %)*

TCR (± ppm/°C)*

Power Rating

Voltage Rating

Operating Range

Product Levels

Noise (dB)

-20

-40

125

100

0.5

ceramic board

1.0 1.5 2.0

Power (W)

2.5

Power Dissipation

fiber epoxy board

*see QPL55342 for part number availability

Resistance Value (Ω)

Maximum Allowable Drift

Temperature Characteristic

TCR (ppm/°C)

Thermal Shock

Power Conditioning

Low Temperature Operation

Short Time Overload

High Temperature Exposure

Moisture Resistance

Life (Qualification)

Life (FR Level)

Resistance to Soldering Heat

Resistance to Bonding Exposure

±100

±0.5%

±0.25%

±0.5%

±2.0%

±0.25%

±200

±0.5%

±0.25%

±0.5%

±2.0%

±0.25%

±300

±0.5%

±1.0%

±0.5%

±2.0%

±0.25%

0.5

Drift (|%∆R|)

0.4

0.3

0.2

0.1

Life Test

Percent Power

100

Temperature Rise (°C)

Power Derating

4k 6k

Hours

10k

-10

150

Ambient Temperature (°C)

Part Number

M55342K10B100DS -TR

Packaging: -TR: Tape & Reel

Product Level (/1000 hrs.): M: 1%

Resistance Value and Tolerance:

Three numerals and a letter indicating

decimal, value range, and tolerance

-W: Waffle Tray

P: 0.1%

R & U: 0.01%

S & V: 0.001%

T: Space 0.001%

Ω: D: 1% G: 2% J: 5% M: 10%

kΩ: E: 1% H: 2% K: 5% N: 10%

MΩ: F: 1% T: 2% L: 5% P: 10%

Termination Material: B: Solderable (SnPb solder over nickel)

Size: 10: RM1010

Temperature Characteristic (ppm/°C): K: ±100

Performance Specification MIL-PRF-55342

L: ±200

M: ±300

Mechanical

Length (a)

Width (b)

Thickness (c)

Top Termination (d)

Bottom Termination (e)

Approximate Weight

Inches

.101(.098 - .112)

.095(.095 - .105)

.018(.015 - .033)

.015(.010 - .020)

0.01050 g

Millimeters

2.57(2.49 - 2.84)

2.41(2.41 - 2.67)

0.46(0.38 - 0.84)

0.38(0.25 - 0.51)

.131

Recommended

Minimum

Bond Pads

(inches)

.033

.065

.101

State of the Art, Inc.

www.resistor.com

Specifications Subject to Change Without Notice

2470 Fox Hill Road, State College, PA, USA 16803-1797

Telephone: 814-355-8004 Toll Free: 800-458-3401 Fax: 814-355-2714

All Products Made in the USA

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