Bulletin I0504J rev. H 03/07
SC180.....5. Series
SCHOTTKY DIE 180 x 150 mils
40 (157)
Wafer flat alligned with
side b of the die
a
c
0.35 ± 0.01
(14 ± 0.4)
C
A
D
b
d
NOTES:
Ø
Ø 125 (492)
1. ALL DIMENSIONS ARE SHOWN IN
MILLIMETERS (MILS).
2. CONTROLLING DIMENSION: (MILS).
3. LETTER DESIGNATION:
A = Anode (Top Metal)
C = Cathode (Back Metal)
D = Reject Ink Dot (only on non-conforming dies)
NOT TO SCALE
4. SAWING:
Recommended Blade
SEMITEC S1025 QS00 Blade
Sawing Street
0.05 + 0, - 0.005
(2 + 0, - 0.2)
5. DIMENSIONS AND TOLERANCES
Device
#
SC180
R
015x5x
SC180
S
020x5x
SC180
S
030x5x
SC180
S
045x5x
SC180
S
060x5x
SC180
H
045x5x (*)
SC180
H
100x5x
SC180
H
150x5x
T
J
Max.
(°C)
125
150
150
150
150
175
175
175
V
R
(V)
15
20
30
45
60
45
100
150
A
B
C
D
diameter
3.81 + 0, - 0.01 4.57 + 0, - 0.01 3.66 + 0, - 0.01 4.42 + 0, - 0.01
(150 + 0, - 0.4) (180 + 0, - 0.4) (144 + 0, - 0.4) (174 + 0, - 0.4)
n.a. contact factory
3.81 + 0, - 0.01 4.57 + 0, - 0.01 3.66 + 0, - 0.01 4.42 + 0, - 0.01
(150 + 0, - 0.4) (180 + 0, - 0.4) (144 + 0, - 0.4) (174 + 0, - 0.4)
3.81 + 0, - 0.01 4.57 + 0, - 0.01 3.66 + 0, - 0.01 4.42 + 0, - 0.01
(150 + 0, - 0.4) (180 + 0, - 0.4) (144 + 0, - 0.4) (174 + 0, - 0.4)
3.81 + 0, - 0.01
(150 + 0, - 0.4)
3.81 + 0, - 0.01
(150 + 0, - 0.4)
4.57 + 0, - 0.01 3.66 + 0, - 0.01
(180 + 0, - 0.4) (144 + 0, - 0.4)
4.57 + 0, - 0.01 3.66 + 0, - 0.01
(180 + 0, - 0.4) (144 + 0, - 0.4)
4.42 + 0, - 0.01
(174 + 0, - 0.4)
4.42 + 0, - 0.01
(174 + 0, - 0.4)
1 ± 0.15
40 ± 6
1 ± 0.15
40 ± 6
1 ± 0.15
40 ± 6
1 ± 0.15
40 ± 6
1 ± 0.15
40 ± 6
1 ± 0.15
40 ± 6
1 ± 0.15
40 ± 6
3.81 + 0, - 0.01 4.57 + 0, - 0.01 3.66 + 0, - 0.01 4.42 + 0, - 0.01
(150 + 0, - 0.4) (180 + 0, - 0.4) (144 + 0, - 0.4) (174 + 0, - 0.4)
3.81 + 0, - 0.01 4.57 + 0, - 0.01 3.66 + 0, - 0.01 4.42 + 0, - 0.01
(150 + 0, - 0.4) (180 + 0, - 0.4) (144 + 0, - 0.4) (174 + 0, - 0.4)
(*) Thickness 0.25 ± 0.01 (10 ± 0.4)
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1
SC180.....5.
Bulletin I0504J rev. H 03/07
Electrical Characteristics
Device
#
SC180
R
015x5x
SC180
S
020x5x
SC180
S
030x5x
SC180
S
045x5x
SC180
S
060x5x
SC180
H
045x5x
SC180
H
100x5x
SC180
H
150x5x
T
J
Max.
(°C)
125
150
150
150
150
175
175
175
V
R
(V)
15
20
30
45
60
45
100
150
400
300
250
60
20
7
Typ. I
R
@ 25°C Typ. I
R
@ 125°C
(μA)
(mA)
5000
450 (100°C)
n.a. contact factory
180
145
130
21
13
72
0.50 @ 30A
0.49 @ 20A
0.53 @ 20A
0.61 @ 30A
0.77 @ 20A
0.88 @ 30A
TO-220
TO-247
TO-247
TO-220 ELF
TO-247
TO-220
Max. V
F
@ I
F
@ 25°C
(V)
0.36 @ 19A
Package
Style
TO-220
Mechanical Data
Device
#
SC180xxxx
A
5x
SC180xxxx
S
5x
Bondable
Solderable
--
Ti 2 kÅ
Metal Thickness
Front Metal
Al (1% Si) 30 kÅ
Ni 1 kÅ
--
Ag 35 kÅ
Cr 1 kÅ
Cr 1 kÅ
Metal Thickness
Back Metal
Ni 2 kÅ
Ni 2 kÅ
Ag 3 kÅ
Ag 3 kÅ
Recommended Storage Environment: Store in original container, in dessicated nitrogen, with no contamination.
Shelf life for parts stored in above condition is 2 years.
If the storage is done in normal atmosphere shelf life is reduced to six months.
Packaging
Device
#
SC180xxxxx5
B
SC180xxxxx5
R
SC180xxxxx5
P
SC180xxxxx5
F
Description
Minimum Order Quantity
Die in Sale Package
560
n.a.
560
560
Inked Probed Unsawn Wafer (Wafer in Box)
Probed Die in Tape & Reel
Probed Die in Waffle Pack
Inked Probed Sawn Wafer on Film
2
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SC180.....5.
Bulletin I0504J rev. H 03/07
Data and specifications subject to change without notice.
This product has been designed for Industrial Level.
Qualification Standards can be found on IR's Web site.
IR WORLD HEADQUARTERS:
233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7309
Visit us at www.irf.com for sales contact information. 03/07
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5