Fixed Resistor, Metal Glaze/thick Film, 0.05W, 9310ohm, 30V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
package instruction | CHIP |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
structure | Rectangular |
JESD-609 code | e0 |
Installation features | THROUGH HOLE MOUNT |
Number of terminals | 2 |
Maximum operating temperature | 150 °C |
Minimum operating temperature | -60 °C |
Package height | 0.46 mm |
Package length | 1.07 mm |
Package shape | RECTANGULAR PACKAGE |
Package form | SMT |
Package width | 0.56 mm |
method of packing | TR |
Rated power dissipation(P) | 0.05 W |
Rated temperature | 70 °C |
Guideline | MIL-PRF-55342/11 |
resistance | 9310 Ω |
Resistor type | FIXED RESISTOR |
size code | 0402 |
surface mount | NO |
technology | METAL GLAZE/THICK FILM |
Temperature Coefficient | 100 ppm/°C |
Terminal surface | Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier |
Terminal shape | WRAPAROUND |
Tolerance | 1% |
Operating Voltage | 30 V |
M55342K11B9E31R-TR | M55342K11B4D42S-TR | M55342K11B200DR-W | M55342K11B7D87R-W | |
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Description | Fixed Resistor, Metal Glaze/thick Film, 0.05W, 9310ohm, 30V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP | Fixed Resistor, Metal Glaze/thick Film, 0.05W, 4.42ohm, 30V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP | Fixed Resistor, Metal Glaze/thick Film, 0.05W, 200ohm, 30V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP | Fixed Resistor, Metal Glaze/thick Film, 0.05W, 7.87ohm, 30V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0402, CHIP |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
package instruction | CHIP | CHIP | CHIP | SMT, 0402 |
Reach Compliance Code | not_compliant | _compli | not_compliant | not_compliant |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
structure | Rectangular | Rectangul | Rectangular | Rectangular |
JESD-609 code | e0 | e0 | e0 | e0 |
Installation features | THROUGH HOLE MOUNT | THROUGH HOLE MOUNT | THROUGH HOLE MOUNT | THROUGH HOLE MOUNT |
Number of terminals | 2 | 2 | 2 | 2 |
Maximum operating temperature | 150 °C | 150 °C | 150 °C | 150 °C |
Minimum operating temperature | -60 °C | -60 °C | -60 °C | -60 °C |
Package height | 0.46 mm | 0.46 mm | 0.46 mm | 0.46 mm |
Package length | 1.07 mm | 1.07 mm | 1.07 mm | 1.07 mm |
Package shape | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE |
Package form | SMT | SMT | SMT | SMT |
Package width | 0.56 mm | 0.56 mm | 0.56 mm | 0.56 mm |
method of packing | TR | TR | Waffle Pack | Waffle Pack |
Rated power dissipation(P) | 0.05 W | 0.05 W | 0.05 W | 0.05 W |
Rated temperature | 70 °C | 70 °C | 70 °C | 70 °C |
Guideline | MIL-PRF-55342/11 | MIL-PRF-55342/11 | MIL-PRF-55342/11 | MIL-PRF-55342/11 |
resistance | 9310 Ω | 4.42 Ω | 200 Ω | 7.87 Ω |
Resistor type | FIXED RESISTOR | FIXED RESISTOR | FIXED RESISTOR | FIXED RESISTOR |
size code | 0402 | 0402 | 0402 | 0402 |
surface mount | NO | NO | NO | NO |
technology | METAL GLAZE/THICK FILM | METAL GLAZE/THICK FILM | METAL GLAZE/THICK FILM | METAL GLAZE/THICK FILM |
Temperature Coefficient | 100 ppm/°C | 100 ppm/°C | 100 ppm/°C | 100 ppm/°C |
Terminal surface | Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier | Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrie | Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier | Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier |
Terminal shape | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND |
Tolerance | 1% | 1% | 1% | 1% |
Operating Voltage | 30 V | 30 V | 30 V | 30 V |