Memory Circuit, EEPROM+SRAM, Hybrid, CPGA66
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Maximum access time | 50 ns |
JESD-30 code | S-XPGA-P66 |
JESD-609 code | e0 |
Memory IC Type | MEMORY CIRCUIT |
Mixed memory types | EEPROM+SRAM |
Number of terminals | 66 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC |
encapsulated code | PGA |
Encapsulate equivalent code | PGA66,11X11 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 5 V |
Certification status | Not Qualified |
Filter level | MIL-STD-883 Class B (Modified) |
Maximum standby current | 0.046 A |
Maximum slew rate | 0.6 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | HYBRID |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | PIN/PEG |
Terminal pitch | 2.54 mm |
Terminal location | PERPENDICULAR |
Maximum time at peak reflow temperature | 6 |
7M7005S50CHB | 7M7005S945CHB | 7M7005S949CHB | |
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Description | Memory Circuit, EEPROM+SRAM, Hybrid, CPGA66 | Memory IC | Memory IC |
Is it Rohs certified? | incompatible | incompatible | incompatible |
Reach Compliance Code | not_compliant | unknow | unknown |
ECCN code | EAR99 | EAR99 | EAR99 |