03028BR821CMUM datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Passive components> capacitor> 03028BR821CMUM

03028BR821CMUM: DescriptionCeramic Capacitor, Multilayer, Ceramic, 200V, 20% +Tol, 20% -Tol, BR, 15% TC, 0.00082uF, Surface Mount, 0603, CHIP; CategoryPassive components capacitor; File Size560KB，4 Pages; ManufacturerKEMET; Websitehttp://www.kemet.com

Download Datasheet Parametric View All

03028BR821CMUM Overview

Ceramic Capacitor, Multilayer, Ceramic, 200V, 20% +Tol, 20% -Tol, BR, 15% TC, 0.00082uF, Surface Mount, 0603, CHIP

03028BR821CMUM Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
package instruction	, 0603
Reach Compliance Code	not_compliant
ECCN code	EAR99
Other features	STANDARD: MIL-PRF-55681
capacitance	0.00082 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	0.91 mm
JESD-609 code	e0
length	1.6 mm
Manufacturer's serial number	03028
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	20%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	SMT
method of packing	WAFFLE PACK
positive tolerance	20%
Rated (DC) voltage (URdc)	200 V
Guideline	MIL-PRF-55681
series	03028
size code	0603
surface mount	YES
Temperature characteristic code	BR
Temperature Coefficient	15% ppm/°C
Terminal surface	Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Terminal shape	WRAPAROUND
width	0.81 mm

Preview

Download Datasheet

View All

Surface Mount Multilayer Ceramic Chip Capacitors

DSCC Approved 03028 (BR/BX Dielectrics)

Overview

KEMET is approved to DSCC (Defense Supply Center, Columbus)

drawing no. 03028 for surface mount EIA 0603 case size multi-

layer ceramic capacitors (MLCCs) in BR and BX dielectrics.

DSCC MLCC control drawings are managed by the Defense

Logistics Agency (DLA) and represent devices with case

sizes, voltage ratings, and capacitance offerings not currently

referenced in a valid military speciﬁcation. Approved devices

must meet the stringent requirements, speciﬁcations and

standards outlined by DSCC.

DSCC drawing no. 03028 was developed in response to the

growing need and demand within the defense and aerospace

industries for EIA 0603 case size MLCCs not currently offered

in MIL-PRF-55681. KEMET’s DSCC approved capacitors

meet the requirements, speciﬁcations and standards outlined

in drawing no. 03028 as well as all referenced provisions per

MIL-PRF-55681.

Beneﬁts

Applications

• EIA 0603 case size

• Defense Supply Center, Columbus approved

• Federal Stock Control Number, Cage Code 31433

• Meets US Department of Defense (USDoD) speciﬁcations

per MIL-PRF-55681

• Meets USDoD standards per MIL-STD-202 & MIL-STD-1285

• High reliability

• Surface mount device

• Non-polar

Typical applications include decoupling, bypass,

ﬁ

ltering, blocking

and energy storage for use in military and aerospace applications.

Outline Drawing

70Sn/30Pb

Nickel Plate

Conductive Metallization

Electrodes

Dimensions - Millimeters (Inches)

EIA SIZE

CODE

0603

METRIC

SIZE CODE

1608

LENGTH^

WIDTH^

BANDWIDTH

THICKNESS

Maximum

0.91 (.036)

1.60 (.063) ± 0.15 (.006) 0.81 (.032) ± 0.15 (.006) 0.36 (.014) ± 0.15 (.006)

^For symbol “U” termination add .20 inches (0.51mm) to the positive length tolerance and .015 inches (0.38mm) to the positive width and thickness tolerances.

Ordering Information

03028

DSCC Drawing

Number

03028 (0603 case size)

Dielectric

104

Capacitance

Code (pF)

2 Sig. Digits +

Number of

Zeros

Voltage

W = 6.3V

X = 10V

Y = 16V

Z = 25V

A = 50V

B = 100V

C = 200V

Capacitance

Tolerance

J = ±5%

K = ±10%

M = ±20%

End

Metallization^

U = SnPb (4% min)

Z = SnPb (4% min)

Group C

Testing Option

Blank = No group C testing

C = Full group C

L = 2,000 hour life test only

M = 1,000 hour life test only

H = Low voltage humidity only

7189

Packaging/Grade

(C-Spec)*

Blank = Wafﬂe Pack

7189 = 7” Reel

^ “U” = Base metallization-barrier metal-solder coated (tin/lead alloy, with a min of 4% lead). Melting point is +200ºC or less. Metallization thickness is

≥

60μ-inches.

^ “Z” = Base metallization-barrier metal-tinned (tin/lead alloy, with a min of 4% lead).

* Additional reeling or packaging options may be available. Contact KEMET for details.

Additional termination options may be available. Contact KEMET for details.

F4004 06/10

Recommended Resources

Combustible gas alarm circuit

Three-chip schematic block diagram and composed position servo system

Nickel-cadmium battery pack automatic charger circuit

High voltage output power supply circuit diagram using LAS6351

Subsonic fan speed control remote control circuit

LM909 (electronic toy) radio remote control receiving and decoding circuit

What is the difference between embedded and microcontroller?: There is actually no standard definition to distinguish between MCU and embedded system. Developers who have developed MCU and embedded system have their own definitions. Next, let’s talk about the in...; Nuli-IT Talking

The Painful Experience of DSP Connecting to Emulator: [size=4]Don't plug or unplug while power is on[/size] [size=4] [/size] [size=4]Don't plug or unplug while power is on[/size] [size=4] [/size] [size=4]Don't plug or unplug while power is on[/size] [siz...; 灞波儿奔 DSP and ARM Processors

BleFi - BLE Wifi IOT Gateway Reference Design: BleFi - BLE Wifi IOT Gateway Reference DesignDescriptionThe gateway connects Bluetooth Smart devices to the Internet over Wi-Fi. It enables Bluetooth Smart nodes to be used in home/building automation...; fish001 Wireless Connectivity

About the selection of energy storage inductor in DCDC circuit?: In the DCDC circuit in the figure, the output current is about 250mA. If I choose the inductor value of L2 as shown in MSS1210 in Figure 2, are the parameters appropriate? What is the difference betwe...; 西里古1992 Analog electronics

[Analog Electronics Course Selection Test] + Assessment: [color=#343434][font="]Course selection website ( [url]https://en.eeworld.com/bbs/huodong/TI_hpl/index.php[/url] ) This function is developed for electronic novices. It can generate a targeted course ...; xiaozhuang TI Technology Forum

Matrix keyboard problem: I use STM32 to write a matrix keyboard program. I have posted several posts before, but I have never finished it.Circuit Diagram:Code: /****************************************************************...; chenbingjy stm32/stm8

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components