The substrate of chip resistors is alumina. Cracks may occur at the connection of solder (solder fillet portion) due to the difference of the coefficient of thermal expansion from a
mounting board when heat stress like heat cycle, etc. are repeatedly given to them. Care should be taken to the occurrence of the cracks when the change in ambient temperature or
ON/OFF of load is repeated, especially when large types of W2H/W3A which have large thermal expansion and also self heating. By general temperature cycle test using glass-
epoxy(FR-4) boards under the maximum/minimum temperatures of operating temperature range, the crack does not occur easily in the types of 1E〜2E, but the crack tends to
occur in the types of W2H/W3A. The occurrence of the crack by heat stress may be influenced by the size of a pad, solder volume, heat radiation of mounting board etc., so please
pay careful attention to designing when a big change in ambient temperature and conditions for use like ON/OFF of load can be assumed.
[i=s]This post was last edited by wushuisheng on 2020-4-18 20:28[/i]After receiving the kit, I encountered the problem that the USB driver could not be recognized. When I downloaded and installed the ...
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ST MEMS Sensor Creative Design Competition
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