Memory Circuit, Flash+SRAM, 128KX16, CMOS, CQFP68, 22.40 MM, CERAMIC, QFP-68
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | 22.40 MM, CERAMIC, QFP-68 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 70 ns |
Other features | SRAM IS ORGANISED AS 128K X 16 OR 256K X 8; FLASH CAN ALSO BE ORGANISED AS 256K X 8 |
JESD-30 code | S-CQFP-G68 |
JESD-609 code | e0 |
length | 23.88 mm |
memory density | 2097152 bit |
Memory IC Type | MEMORY CIRCUIT |
memory width | 16 |
Mixed memory types | FLASH+SRAM |
Number of functions | 1 |
Number of terminals | 68 |
word count | 131072 words |
character code | 128000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 128KX16 |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | QFP |
Encapsulate equivalent code | QFP68,.99SQ,50 |
Package shape | SQUARE |
Package form | FLATPACK |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 3.56 mm |
Maximum standby current | 0.04 A |
Maximum slew rate | 0.36 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 23.88 mm |