MULTIPLEXER
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | not_compliant |
JESD-30 code | R-XDIP-T16 |
JESD-609 code | e0 |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | MULTIPLEXER |
MaximumI(ol) | 0.012 A |
Number of functions | 4 |
Number of entries | 2 |
Number of terminals | 16 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 3.3/5 V |
Prop。Delay @ Nom-Sup | 9 ns |
Certification status | Not Qualified |
Filter level | 38535Q/M;38534H;883B |
Minimum supply voltage (Vsup) | 1.5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
CD54AC157F3A | |
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Description | MULTIPLEXER |
Is it Rohs certified? | incompatible |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | not_compliant |
JESD-30 code | R-XDIP-T16 |
JESD-609 code | e0 |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | MULTIPLEXER |
MaximumI(ol) | 0.012 A |
Number of functions | 4 |
Number of entries | 2 |
Number of terminals | 16 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 3.3/5 V |
Prop。Delay @ Nom-Sup | 9 ns |
Certification status | Not Qualified |
Filter level | 38535Q/M;38534H;883B |
Minimum supply voltage (Vsup) | 1.5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |