Page No. : 1/9
RS7213
300mA High Speed, Low Noise LDO with Fast Enable and Fast Discharge Function
General Description
The RS7213 series is a low‐dropout linear regulator with ON/OFF control that operates in the input voltage range from
+1.8V to +5.5V and delivers 300mA output current.
The fixed output voltage is preset at an internally trimmed voltage 1.8V, 2.5V, or 3.3V. Other options 1.0V, 1.2V, 1.5V, 2.2V,
3.0V and 3.6V are available by special order only.
The RS7213 consists of a 0.87V bandgap reference, an error amplifier, and a P‐channel pass transistor. Other features
include short‐circuit protection, thermal shutdown protection, fast respond and fast discharge functions. The RS7213 series
devices are available in SOT‐25 & SC‐70‐5 packages.
Features
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Operating Voltage Range：+1.8V to +5.5V
Output Voltages：+0.9V to +5.0V (0.1V Step)
Dropout Voltage：90mV@100mA (Typ.)
Fast Response in Power‐on Transient：35μS (Typ.)
Low Current Consumption：30μA (Typ.)
Shutdown Current：0.7μA (Typ.)
±2% Output Voltage Accuracy (special ±1%highly
accurate), V
OUT
≧1.8V
Low ESR Capacitor Compatible
High Ripple Rejection：70dB (Typ.)
Output Current Limit Protection：500mA (Typ.)
Short Circuit Protection：70mA (Typ.)
Thermal Overload Shutdown Protection
Control Output ON/OFF Function
SOT‐25 & SC‐70‐5 Packages
RoHS Compliant and 100% Lead (Pb)‐Freeand Green
(Halogen Free with Commercial Standard)
Applications
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Battery‐powered equipment
Voltage regulator for microprocessor
Voltage regulator for LAN cards
Wireless Communication equipment
Audio/Video equipment
Post Regulator for Switching Power
Home Electric/Electronic Appliance
CDMA/GSM Cellular Handsets
Laptop, Palmtops, Notebook Computers
Portable Information Application
Application Circuits
This integrated circuit can be damaged by ESD. Orister Corporation recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DS‐RS7213‐02
September, 2009
www.Orister.com
Page No. : 2/9
Pin Assignment
SOT‐25
SC‐70‐5
PACKAGE
PIN
1
2
3
4
5
PIN
1
2
3
4
5
SYMBOL
VIN
GND
EN
NC
VOUT
SYMBOL
VIN
GND
EN
NC
VOUT
DESCRIPTION
Regulator Input Pin
Ground Pin
Chip Enable Pin
No Connection
Regulator Output Pin
DESCRIPTION
Regulator Input Pin
Ground Pin
Chip Enable Pin
No Connection
Regulator Output Pin
SOT‐25
PACKAGE
SC‐70‐5
Ordering Information
DEVICE
DEVICE CODE
XX is nominal output voltage (for example, 18 = 1.8V, 33 = 3.3V, 285 = 2.85V).
EEE is CE Input Logic & Discharge Function Selection : (see CE & Discharge Function Selection
Table)
YY is package designator :
NE : SOT‐25
SC : SC‐70‐5
Z is Lead Free designator :
P: Commercial Standard, Lead (Pb) Free and Phosphorous (P) Free Package
G: Green (Halogen Free with Commercial Standard)
RS7213‐XX EEE YY Z
CE & Discharge Function Selection Table
EEE
CODE
NHF
NLF
NHN
NLN
UHF
ULF
EN Type
Type 1
None
None
None
None
Pull High
Pull High
Type 2
High Active
Low Active
High Active
Low Active
High Active
Low Active
Discharge
Fast
Fast
Normal
Normal
Fast
Fast
EEE
CODE
UHN
ULN
DHF
DLF
DHN
DLN
EN Type
Type 1
Pull High
Pull High
Pull Low
Pull Low
Pull Low
Pull Low
Type 2
High Active
Low Active
High Active
Low Active
High Active
Low Active
Discharge
Normal
Normal
Fast
Fast
Normal
Normal
DS‐RS7213‐02
September, 2009
www.Orister.com
Page No. : 3/9
Block Diagram
Absolute Maximum Ratings
Parameter
Input Voltage V
IN
to GND
Output Current Limit, I
(LIMIT)
Junction Temperature
Thermal Resistance
Power Dissipation
SOT‐25
SC‐70‐5
SOT‐25
SC‐70‐5
Symbol
V
IN
I
LIMIT
T
J
θ
JA
P
D
T
OPR
T
STG
‐
Ratings
6.0
0.5
+155
250
333
400
200
‐40 ~ +125
‐55~+150
+260
Units
V
A
o
C
o
C/W
mW
o
o
Operating Ambient Temperature
Storage Temperature
Lead Temperature (soldering, 10sec)
C
C
o
C
NOTES：
1
The power dissipation values are based on the condition that junction temperature T
J
and ambient temperature T
A
difference is
100°C.
2
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress
ratings only, and function operation of the device at these or any other conditions beyond those indicated under “recommended
operating conditions” is not implied. Exposure to absolute‐maximum –rated conditions for extended periods may affect device
reliability.
DS‐RS7213‐02
September, 2009
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Page No. : 4/9
Electrical Characteristics
(V
IN
=5V, T
A
=25°C, unless otherwise specified)
Symbol
V
IN
V
OUT
I
MAX
V
DROP
ΔV
LINE
ΔV
LOAD
I
Q
I
SD
I
SC
PSRR
e
N
V
IH
V
IL
R
DIS
T
DIS
T
C
Parameter
Input Voltage
Output Voltage
Output Current (see NOTE 1)
Dropout Voltage
Line Regulation
Load Regulation
Ground Pin Current
Shutdown Current
Short Circuit Current
Ripple Rejection
Output Noise
EN Pin Input Voltage “H”
EN Pin Input Voltage “L”
Discharge Resistor
Discharge Time
Temperature Characteristics
Conditions
‐
V
IN
=V
OUT
+1.0V, I
OUT
=1mA,
VOUT≧1.8V
VIN=V
OUT
+1.0V, I
OUT
=1mA,
V
OUT
＜1.8V, V
IN
＞2.4V
V
OUT
+1.0V≦V
IN
≦5.5V, V
IN
≧2.4V
I
OUT
=300mA, V
OUT
＞2.0V
V
OUT
+1.0V≦V
IN
≦5.5V, I
OUT
=1mA
V
IN
=V
OUT
+1V, 1mA≦I
OUT
≦100mA
I
LOAD
=0mA to 300mA, V
IN
=V
OUT
+1V
V
IN
=V
OUT
+1V, EN=0V, No Load
‐
I
OUT
=30mA, F=1KHz, C
OUT
=1uF
I
OUT
=100mA , F=1KHz, C
OUT
=1uF
V
IN
≦5.0V
V
IN
≦5.0V
V
EN
=0V
V
OUT
=3.3V to 0V, C
OUT
=1uF
I
OUT
=1mA, ‐25°C≦T
OPR
≦+85°C
Min.
1.8
‐2%
V
OUT
‐35
300
‐
‐
‐
‐
‐
‐
‐
‐
1.6
‐
‐
‐
‐
‐
300
0.2
0.01
30
0.7
70
70
40
‐
‐
30
70
±100
+35
‐
500
0.3
0.02
50
1.0
‐
‐
‐
‐
0.3
100
100
‐
mV
mA
mV
%/V
%/mA
uA
uA
mA
dB
uV
(rms)
V
V
Ω
us
ppm/
o
C
o
C
o
C
Typ.
‐
Max.
5.5
+2%
Unit
V
V
T
SD
Thermal Shutdown Temperature
‐
‐
150
‐
T
HYS
Thermal Shutdown Hysteresis
‐
‐
30
‐
NOTES：
1
Measured using a double sided board with 1” x 2” square inches of copper area connected to the GND pins for “heat spreading”.
DS‐RS7213‐02
September, 2009
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Page No. : 5/9
Detail Description
The RS7213 is a low‐dropout linear regulator. The device provides preset 1.8V, 2.5V and 3.3V output voltages for output
current up to 300mA. Other mask options for special output voltages are also available. As illustrated in function block
diagram, it consists of a 0.87V bandgap reference, an error amplifier, a P‐channel pass transistor and an internal feedback
voltage divider.
The bandgap reference for is connected to the error amplifier, which compares this reference with the feedback voltage and
amplifies the voltage difference. If the feedback voltage is lower than the reference voltage, the pass transistor’s gate is
pulled lower, which allows more current to pass to the output pin and increases the output voltage. If the feedback voltage is
too high, the pass transistor’s gate is pulled up to decrease the output voltage.
The output voltage is feed back through an internal resistor divider connected to V
OUT
pin. Additional blocks include an
output current limiter, thermal sensor, and shutdown logic.
Internal P‐channel Pass Transistor
The RS7213 features a P‐channel MOSFET pass transistor. Unlike similar designs using PNP pass transistors, P‐channel
MOSFETs require no base drive, which reduces quiescent current. PNP‐based regulators also waste considerable current in
dropout when the pass transistor saturates, and use high base‐drive currents under large loads. The RS7213 does not suffer
from these problems and consumes only 30μA (Typ.) of current consumption under heavy loads as well as in dropout
conditions.
Enable Function
EN pin starts and stops the regulator. When the EN pin is switched to the power off level, the operation of all internal circuit
stops, the build‐in P‐channel MOSFET output transistor between pins V
IN
and V
OUT
is switched off, allowing current
consumption to be drastically reduced. The V
OUT
pin enters the GND level through the internal discharge path between V
OUT
and GND pins.
Operating Region and Power Dissipation
Maximum power dissipation of the RS7213 depends on the thermal resistance of the case and circuit board, the temperature
difference between the die junction and ambient air, and the rate of airflow. The power dissipation across the devices is P =
I
OUT
x (V
IN
‐V
OUT
). The resulting maximum power dissipation is:
P
MAX
=
( T
J
−
T
A
) ( T
J
−
T
A
)
=
θ
JC
+ θ
CA
θ
JA
Where (T
J
‐T
A
) is the temperature difference between the RS7213 die junction and the surrounding air,
θ
JC
is the thermal
resistance of the package chosen, and
θ
CA
is the thermal resistance through the printed circuit board, copper traces and
other materials to the surrounding air. For better heat‐sinking, the copper area should be equally shared between the V
IN
,
V
OUT
, and GND pins.
The thermal resistance θ
JA
of SOT‐25 package of RS7213 is 250°C/W. Based on a maximum operating junction temperature
125°C with an ambient of 25°C, the maximum power dissipation will be:
P
MAX
=
( T
J
−
T
A
) (125
−
25)
=
=
0.40W
θ
JC
+ θ
CA
250
Thermal characteristics were measured using a double sided board with 1”x2” square inches of copper area connected to the
GND pin for “heat spreading”.
Dropout Voltage
A regulator’s minimum input‐output voltage differential, or dropout voltage, determines the lowest usable supply voltage. In
battery‐powered systems, this will determine the useful end‐of‐life battery voltage. The RS7213 use a P‐ channel MOSFET
pass transistor, its dropout voltage is a function of drain‐to‐source on‐resistance R
DS(ON)
multiplied by the load current.
V
DROPOUT
=
V
IN
−
V
OUT
=
R
DS ( ON)
×
I
OUT
DS‐RS7213‐02
September, 2009
www.Orister.com
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