Memory Circuit, 1KX8, TTL, CDIP24,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | AMD |
package instruction | DIP, DIP24,.3 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
JESD-30 code | R-XDIP-T24 |
memory density | 8192 bit |
Memory IC Type | MEMORY CIRCUIT |
memory width | 8 |
Number of terminals | 24 |
word count | 1024 words |
character code | 1000 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 1KX8 |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP24,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Certification status | Not Qualified |
Filter level | 38535Q/M;38534H;883B |
surface mount | NO |
technology | TTL |
Temperature level | MILITARY |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |