100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236AB
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | NXP |
Parts packaging code | TO-92 |
package instruction | CYLINDRICAL, O-PBCY-T3 |
Contacts | 3 |
Reach Compliance Code | unknow |
ECCN code | EAR99 |
Other features | BUILT IN BIAS RESISTANCE RATIO IS 4.7 |
Maximum collector current (IC) | 0.1 A |
Collector-emitter maximum voltage | 50 V |
Configuration | SINGLE WITH BUILT-IN RESISTOR |
Minimum DC current gain (hFE) | 100 |
JEDEC-95 code | TO-92 |
JESD-30 code | O-PBCY-T3 |
JESD-609 code | e3 |
Number of components | 1 |
Number of terminals | 3 |
Package body material | PLASTIC/EPOXY |
Package shape | ROUND |
Package form | CYLINDRICAL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Polarity/channel type | NPN |
Maximum power dissipation(Abs) | 0.5 W |
Certification status | Not Qualified |
surface mount | NO |
Terminal surface | Matte Tin (Sn) |
Terminal form | THROUGH-HOLE |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
transistor applications | SWITCHING |
Transistor component materials | SILICON |
PDTC114YS | PDTC114Y | PDTC114YE | PDTC114YEF | PDTC114YK | PDTC114YM | PDTC114YT | PDTC114YU | |
---|---|---|---|---|---|---|---|---|
Description | 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236AB | 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236AB | 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236AB | 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236AB | 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236AB | 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236AB | 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-236AB | 100 mA, 50 V, NPN, Si, SMALL SIGNAL TRANSISTOR |
Number of components | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
surface mount | NO | Yes | YES | YES | YES | YES | YES | YES |
Terminal form | THROUGH-HOLE | GULL WING | GULL WING | FLAT | GULL WING | NO LEAD | GULL WING | GULL WING |
Terminal location | BOTTOM | DUAL | DUAL | DUAL | DUAL | BOTTOM | DUAL | DUAL |
transistor applications | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
Transistor component materials | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
Is it Rohs certified? | conform to | - | conform to | conform to | conform to | conform to | conform to | conform to |
Parts packaging code | TO-92 | - | SC-75 | SC-89 | SOT-23 | SC-101 | SOT-23 | SC-70 |
package instruction | CYLINDRICAL, O-PBCY-T3 | - | PLASTIC, SC-75, 3 PIN | PLASTIC, SC-89, 3 PIN | PLASTIC, SC-59A, 3 PIN | 1 X 0.60 MM, 0.50 MM HEIGHT, LEADLESS, PLASTIC, SC-101, 3 PIN | PLASTIC PACKAGE-3 | PLASTIC, SC-70, 3 PIN |
Contacts | 3 | - | 3 | 3 | 3 | 3 | 3 | 3 |
Reach Compliance Code | unknow | - | compli | unknow | unknow | compli | compli | compli |
ECCN code | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Other features | BUILT IN BIAS RESISTANCE RATIO IS 4.7 | - | BUILT IN BIAS RESISTANCE RATIO IS 4.7 | BUILT IN BIAS RESISTANCE RATIO IS 4.7 | BUILT IN BIAS RESISTANCE RATIO IS 4.7 | BUILT IN BIAS RESISTANCE RATIO IS 4.7 | BUILT IN BIAS RESISTANCE RATIO IS 4.7 | BUILT IN BIAS RESISTANCE RATIO IS 4.7 |
Maximum collector current (IC) | 0.1 A | - | 0.1 A | 0.1 A | 0.1 A | 0.1 A | 0.1 A | 0.1 A |
Collector-emitter maximum voltage | 50 V | - | 50 V | 50 V | 50 V | 50 V | 50 V | 50 V |
Configuration | SINGLE WITH BUILT-IN RESISTOR | - | SINGLE WITH BUILT-IN RESISTOR | SINGLE WITH BUILT-IN RESISTOR | SINGLE WITH BUILT-IN RESISTOR | SINGLE WITH BUILT-IN RESISTOR | SINGLE WITH BUILT-IN RESISTOR | SINGLE WITH BUILT-IN RESISTOR |
Minimum DC current gain (hFE) | 100 | - | 100 | 100 | 100 | 100 | 100 | 100 |
JESD-30 code | O-PBCY-T3 | - | R-PDSO-G3 | R-PDSO-F3 | R-PDSO-G3 | R-PBCC-N3 | R-PDSO-G3 | R-PDSO-G3 |
JESD-609 code | e3 | - | e3 | e3 | e3 | e3 | e3 | e3 |
Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package shape | ROUND | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | CYLINDRICAL | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | CHIP CARRIER | SMALL OUTLINE | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | 260 | NOT SPECIFIED | 260 | 260 | 260 | 260 |
Polarity/channel type | NPN | - | NPN | NPN | NPN | NPN | NPN | NPN |
Maximum power dissipation(Abs) | 0.5 W | - | 0.15 W | 0.25 W | 0.25 W | 0.25 W | 0.25 W | 0.2 W |
Certification status | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Terminal surface | Matte Tin (Sn) | - | Tin (Sn) | Tin (Sn) | Matte Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) |
Maximum time at peak reflow temperature | NOT SPECIFIED | - | 30 | NOT SPECIFIED | 40 | 30 | 30 | 30 |