PCF8564A
Real time clock and calendar
Rev. 1 — 8 October 2009
Product data sheet
1. General description
The PCF8564A is a CMOS
1
real-time clock and calendar optimized for low power
consumption. A programmable clock output, interrupt output and voltage low detector are
also provided. All addresses and data are transferred serially via a two-line bidirectional
I
2
C-bus. Maximum bus speed is 400 kbit/s. The built-in word address register is
incremented automatically after each written or read data byte.
2. Features
I
Provides year, month, day, weekday, hours, minutes, and seconds based on a
32.768 kHz quartz crystal
I
Century flag
I
Wide clock operating voltage: 1.0 V to 5.5 V
I
Low back-up current typical 250 nA at 3.0 V and 25
°C
I
400 kHz two-wire I
2
C interface (1.8 V to 5.5 V)
I
Low-voltage detector
I
Alarm and timer functions
I
Two integrated oscillator capacitors
I
Programmable clock output for peripheral devices (32.768 kHz, 1.024 kHz, 32 Hz and
1 Hz)
I
Internal Power-On Reset (POR)
I
I
2
C slave address: read A3h, write A2h
3. Applications
I
I
I
I
Mobile telephones
Portable instruments
Electronic metering
Battery powered products
1.
The definition of the abbreviations and acronyms used in this data sheet can be found in
Section 20.
NXP Semiconductors
PCF8564A
Real time clock and calendar
4. Ordering information
Table 1.
Ordering information
Package
Name
Die type 1
[1]
PCF8564AU/5BD/1
PCF8564AU/5GE/1
PCF8564AU/10AA/1
Die type 2
PCF8564AU/5BB/1
PCF8564AU/5GB/1
PCF8564AU/10AB/1
Die type 3
PCF8564ACX9/1
PCF8564ACX9 wafer level chip-size package;
9 bumps; 1.27
×
1.9
×
0.29 mm
PCF8564ACX9 wafer level chip-size package;
9 bumps; 1.27
×
1.9
×
0.29 mm
wafer sawn on FFC;
thickness 200
µm;
die with solder bumps
tape and reel;
thickness 200
µm;
die with solder bumps
PCF8564ACX9
PCF8564AU
PCF8564AU
PCF8564AU
wire bond die; 9 bonding pads
wire bond die; 9 bonding pads
wire bond die; 9 bonding pads
unsawn wafer;
thickness 280
µm
unsawn wafer;
thickness 687
µm
wafer sawn on FFC;
thickness 200
µm
PCF8564AU
PCF8564AU
PCF8564AU
PCF8564AU
PCF8564AU
PCF8564AU
wire bond die; 9 bonding pads
wire bond die; 9 bonding pads
wire bond die; 9 bonding pads
unsawn wafer;
thickness 280
µm
unsawn wafer;
thickness 687
µm
wafer sawn on FFC;
thickness 200
µm
PCF8564AU
PCF8564AU
PCF8564AU
Description
Delivery form
Version
Type number
PCF8564ACX9/B/1
PCF8564ACX9
[1]
Not to be used for new designs.
5. Marking
Table 2.
Die type 1
PCF8564AU/5BD/1
PCF8564AU/5GE/1
PCF8564AU/10AA/1
Die type 2
PCF8564AU/5BB/1
PCF8564AU/5GB/1
PCF8564AU/10AB/1
Die type 3
PCF8564ACX9/1
PCF8564ACX9/B/1
PC8564A-1
PC8564A-1
PC8564A-1
PC8564A-1
PC8564A-1
PC8564A-1
PC8564A-1
PC8564A-1
Marking codes
Marking code
Type number
PCF8564A_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 1 — 8 October 2009
2 of 44
NXP Semiconductors
PCF8564A
Real time clock and calendar
6. Block diagram
CLKOE
OSCI
OSCILLATOR
32.768 kHz
OSCO
MONITOR
00h
01h
0Dh
POWER ON
RESET
TIME
02h
03h
VDD
VSS
04h
05h
06h
07h
WATCH
DOG
08h
Seconds
Minutes
Hours
Days
Weekdays
Months
Years
CONTROL
Control_1
Control_2
CLKOUT_ctrl
DIVIDER
CLOCK OUT
CLKOUT
ALARM FUNCTION
09h
0Ah
SDA
SCL
I
2
C
INTERFACE
0Bh
0Ch
Minute_alarm
Hour_alarm
Day_alarm
Weekday_alarm
INTERRUPT
TIMER FUNCTION
INT
PCF8564A
0Eh
0Fh
Timer_ctrl
Timer
001aah660
Fig 1.
Block diagram of PCF8564A
PCF8564A_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 1 — 8 October 2009
3 of 44
NXP Semiconductors
PCF8564A
Real time clock and calendar
7. Pinning information
7.1 Pinning
OSCI
OSCO
1
2
9
CLKOE
OSCI
1
8
9
CLKOE
V
DD
8
y
7
0,0
x
6
V
DD
OSCO
CLKOUT
2
7
y
x
6
CLKOUT
0,0
SCL
INT
3
SCL
INT
3
PCF8564AU
5
SDA
V
SS
4
PCF8564ACX
5
SDA
V
SS
4
013aaa032
013aaa033
Viewed from pad side. For mechanical details, see
Figure 27.
Viewed from bump side. For mechanical details, see
Figure 28.
Fig 2.
Pinning diagram of PCF8564AU
Fig 3.
Pinning diagram of PCF8564ACX9
7.2 Pin description
Table 3.
Symbol
OSCI
OSCO
INT
V
SS
SDA
SCL
CLKOUT
V
DD
CLKOE
[1]
Pin description
Pin
1
2
3
4
5
6
7
8
9
Description
oscillator input
oscillator output
interrupt output, open-drain, active LOW
ground
[1]
serial data input and output
serial clock input
clock output, push-pull
supply voltage
CLKOUT output enable
The substrate (rear side of the die) is wired to V
SS
but should not be electrically contacted.
PCF8564A_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 1 — 8 October 2009
4 of 44
NXP Semiconductors
PCF8564A
Real time clock and calendar
8. Functional description
The PCF8564A contains sixteen 8-bit registers with an auto-incrementing address
register, an on-chip 32.768 kHz oscillator with integrated capacitors, a frequency divider
which provides the source clock for the RTC, a programmable clock output, a timer, a
voltage low detector, and a 400 kHz I
2
C-bus interface.
All sixteen registers (see
Table 4)
are designed as addressable 8-bit parallel registers
although not all bits are implemented. The first two registers (memory address 00h and
01h) are used as control and/or status registers. The addresses 02h through 08h are used
as counters for the clock function (seconds up to years counters). Address locations 09h
through 0Ch contain alarm registers which define the conditions for an alarm. Address
0Dh controls the CLKOUT output frequency. 0Eh and 0Fh are the timer control and timer
registers, respectively.
The seconds, minutes, hours, days, weekdays, months, years, as well as the minute
alarm, hour alarm, day alarm, and weekday alarm registers are all coded in BCD format.
8.1 CLKOUT output
A programmable square wave is available at the CLKOUT pin. Frequencies of 32.768 kHz,
1.024 kHz, 32 Hz and 1 Hz can be generated for use as a system clock, microcontroller
clock, input to a charge pump, or for calibration of the oscillator. CLKOUT is a CMOS
push-pull output, and if disabled it becomes logic 0.
PCF8564A_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 1 — 8 October 2009
5 of 44