EEWORLDEEWORLDEEWORLD

Part Number

Search

HIS068-01TG

Description
IC Socket, PGA68, 68 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,
CategoryThe connector    socket   
File Size261KB,2 Pages
ManufacturerAdvanced Interconnections Corp.
Download Datasheet Parametric View All

HIS068-01TG Overview

IC Socket, PGA68, 68 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,

HIS068-01TG Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerAdvanced Interconnections Corp.
Reach Compliance Codenot_compliant
ECCN codeEAR99
body width1.1 inch
subject depth0.165 inch
body length1.1 inch
Contact structure11X11
Contact to complete cooperationAU ON NI
Contact completed and terminatedTin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Contact materialBE-CU
Contact styleRND PIN-SKT
Device slot typeIC SOCKET
Type of equipment usedPGA68
Shell materialGLASS FILLED THERMOPLASTIC
JESD-609 codee0
Manufacturer's serial numberHIS
Plug contact pitch0.1 inch
Installation methodSTRAIGHT
Number of contacts68
Maximum operating temperature150 °C
Minimum operating temperature-60 °C
PCB contact patternRECTANGULAR
PCB contact row spacing0.1 mm
Terminal pitch2.54 mm
Termination typeSOLDER
PGA Sockets
Table of Models
Low Insertion Force PGA Sockets
.100/(2.54mm) Standard Grid
Description:
Peel-A-Way
®
(KIS)
Material: Polyimide Film
Index: -269°C to 400°C (-452°F to 752°F)
Description:
FR-4 (FIS)
Material: FR-4 Fiberglass Epoxy Board
Index: -40°C to 140°C (-40°F to 284°F)
Features:
• Low insertion force (1 oz. average
per pin).
• Screw-machined terminals with
multiple finger contacts for
reliability.
• Closed bottom terminal for 100%
anti-wicking of solder.
• Tapered entry for ease of
insertion.
• Custom designs available.
Description:
Molded (RIS)
Mat’l: High Temp. Liquid Crystal Polymer (LCP)
Index: -40°C to 260°C (-40°F to 500°F)
RIS replaces HCIS, HCS, CIS, and CS.
?
?
.005
(.13)
PC Board
PC Board
Polyimide
Film
.062
(1.57)
.095
(2.41)
Options
Tape Seal - add 3M to end of part number
• Removable tape seal protects plated contact in harsh environments
• Sealed socket will not allow dirt and other contaminants to enter
socket chamber and become entrapped behind contact fingers
• Spray flux without contaminating contact area
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper
(C17200) ASTM-B-194
Solder Preform:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
M - Matte Tin over Nickel
T - Tin/Lead over Nickel
Gold per ASTM-B-488
Matte Tin per ASTM545-97
Tin/Lead per MIL-P-81728
Nickel per QQ-N-290
Material
Silicone Backed Polyimide Film, -74°C to 260°C (-100°F to 500°F)
Intermittent to 371°C (700°F)
How To Order
1 RIS
Footprint Dash #
If Applicable
*
Body Type
RoHS Compliant Insulators:
KIS - Peel-A-Way
®
068 - 04 M G
Contact Plating
RoHS Compliant:
G - Gold
T - Tin/Lead
Terminal Plating
RoHS Compliant:
FIS - FR-4
RIS - Hi-Temp Molded LCP
Number of Pins
004 to 484
*Footprints available online
G - Gold
M - Matte Tin
T - Tin/Lead
Terminal Type
See options on next page
Note: Terminals plated with Matte Tin are available only with Gold plated contacts.
Quick-Turn delivery is not available on products with Matte Tin plating.
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16
rev. Sept. 07
1 ESX 503 - 234
Footprint Dash #
Body Type
M
G
RoHS Compliant:
Contact Plating
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
If Applicable
*
inch/(mm)
G - Gold
【TI recommended course】#TI millimeter wave radar technology introduction#
//training.eeworld.com.cn/TI/show/course/4353...
linghz TI Technology Forum
Let me talk about two key points of analog electronics learning
Anyone who studies electronics can never avoid analog electronics. All the knowledge that teachers taught in school, all returned to teachers when they graduated. After graduation, I have to engage in...
4567 Analog electronics
R329 Tutorial 1 | Zhouyi AIPU Deployment and Simulation Tutorial
R329 Development Board Tutorial Series This series of tutorials mainly introduces the deployment of AI models on the R329 (MaixSense) board. It is expected to be divided into the following parts:Zhouy...
nmg Domestic Chip Exchange
Msp430F149 flash operation
The msp430F149 has 60k of flash, which is quite amazing for 51. When it comes to flash operations, three registers are often involved, FCTL1, FCTL2, and FCTL3. Suddenly, I found that the registers of ...
火辣西米秀 Microcontroller MCU
May I ask if the common collector, common emitter and common base in analog electronics are connected to the ground using these poles?
May I ask if the common in common collector, common emitter and common base in analog electronics is based on these poles? For example, how is the common collector method used?...
一沙一世 stm32/stm8
IPC-4552B-2021 EN Printed Board Electroless Nickel Immersion Gold (ENIG) Plating Performance Specification English Version
[i=s]This post was last edited by Li Qiang 980702 on 2021-9-30 10:49[/i]...
李强980702 Download Centre

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号