SPI80N04S2-04
SPP80N04S2-04,SPB80N04S2-04
OptiMOS
Power-Transistor
Feature
•
N-Channel
Product Summary
V
DS
R
DS(on)
max. SMD version
I
D
P- TO262 -3-1
P- TO263 -3-2
40
3.4
80
P- TO220 -3-1
V
mΩ
A
•
Enhancement mode
•
175°C operating temperature
•
Avalanche rated
•
d
v
/d
t
rated
Type
SPP80N04S2-04
SPB80N04S2-04
SPI80N04S2-04
Package
Ordering Code
Marking
2N0404
2N0404
2N0404
Value
80
80
Unit
A
P- TO220 -3-1 Q67040-S4260
P- TO263 -3-2 Q67040-S4257
P- TO262 -3-1 Q67060-S6173
Maximum Ratings,
at
T
j
= 25 °C, unless otherwise specified
Symbol
Parameter
Continuous drain current
1)
T
C
=25°C
T
C
=100°C
I
D
Pulsed drain current
T
C
=25°C
I
D puls
E
AS
E
AR
dv/dt
V
GS
P
tot
T
j ,
T
stg
320
810
30
6
±20
300
-55... +175
55/175/56
kV/µs
V
W
°C
mJ
Avalanche energy, single pulse
I
D
=80A,
V
DD
=25V,
R
GS
=25
Ω
Repetitive avalanche energy, limited by
T
jmax
2)
Reverse diode dv/dt
I
S
=80A,
V
DS
=32V,
di/dt
=200A/µs,
T
jmax
=175°C
Gate source voltage
Power dissipation
T
C
=25°C
Operating and storage temperature
IEC climatic category; DIN IEC 68-1
Page 1
2004-05-24
SPI80N04S2-04
SPP80N04S2-04,SPB80N04S2-04
Thermal Characteristics
Parameter
Characteristics
Thermal resistance, junction - case
Thermal resistance, junction - ambient, leaded
SMD version, device on PCB:
@ min. footprint
@ 6 cm
2
cooling area
3)
Symbol
min.
R
thJC
R
thJA
R
thJA
Values
typ.
0.3
-
-
-
max.
0.5
62
62
40
Unit
-
-
-
-
K/W
Electrical Characteristics,
at
T
j
= 25 °C, unless otherwise specified
Parameter
Static Characteristics
Drain-source breakdown voltage
V
GS
=0V,
I
D
=1mA
Symbol
min.
V
(BR)DSS
V
GS(th)
I
DSS
Values
typ.
-
3
max.
-
4
Unit
40
2.1
V
Gate threshold voltage,
V
GS
=
V
DS
I
D
=250µA
Zero gate voltage drain current
V
DS
=40V,
V
GS
=0V,
T
j
=25°C
V
DS
=40V,
V
GS
=0V,
Tj
=125°C
2)
µA
-
-
0.01
1
1
1
100
100
nA
m
Ω
-
-
3
2.7
3.7
3.4
Gate-source leakage current
V
GS
=20V,
V
DS
=0V
I
GSS
R
DS(on)
-
Drain-source on-state resistance
4)
V
GS
=10V,
I
D
=80A
V
GS
=10V,
I
D
=80A,
SMD version
1Current limited by bondwire ; with an
R
thJC
= 0.5K/W the chip is able to carry
I
D
= 208A at 25°C, for detailed
information see app.-note ANPS071E available at
www.infineon.com/optimos
2Defined by design. Not subject to production test.
3Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
4Diagrams are related to straight lead versions
Page 2
2004-05-24
SPI80N04S2-04
SPP80N04S2-04,SPB80N04S2-04
Electrical Characteristics
Parameter
Dynamic Characteristics
Transconductance
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Gate Charge Characteristics
Gate to source charge
Gate to drain charge
Gate charge total
Gate plateau voltage
Symbol
Conditions
min.
Values
typ.
125
5250
1870
420
16
45
50
40
max.
-
Unit
g
fs
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
V
DS
≥2*I
D
*R
DS(on)max
,
I
D
=80A
V
GS
=0V,
V
DS
=25V,
f=1MHz
60
-
-
-
-
-
-
-
S
6980 pF
2490
630
24
68
75
60
ns
V
DD
=20V,
V
GS
=10V,
I
D
=80A,
R
G
=2.2Ω
Q
gs
Q
gd
Q
g
V
DD
=32V,
I
D
=80A
-
-
-
-
25
50
135
5.3
35
75
170
-
nC
V
DD
=32V,
I
D
=80A,
V
GS
=0 to 10V
V
(plateau)
V
DD
= 32 V ,
I
D
=80A
V
Reverse Diode
Inverse diode continuous
forward current
Inv. diode direct current, pulsed
Inverse diode forward voltage
Reverse recovery time
Reverse recovery charge
I
SM
V
SD
t
rr
Q
rr
V
GS
=0V,
I
F
=80A
V
R
=20V,
I
F=
l
S
,
di
F
/dt=100A/µs
I
S
T
C
=25°C
-
-
-
-
-
-
-
0.9
60
100
80
320
1.3
75
125
A
V
ns
nC
Page 3
2004-05-24
SPI80N04S2-04
SPP80N04S2-04,SPB80N04S2-04
1 Power dissipation
P
tot
=
f
(T
C
)
parameter:
V
GS
≥
6 V
320
SPP80N04S2-04
2 Drain current
I
D
=
f
(T
C
)
parameter:
V
GS
≥
10 V
90
SPP80N04S2-04
W
A
240
70
60
P
tot
I
D
50
40
30
20
10
0
0
100 120 140 160
°C
190
200
160
120
80
40
0
0
20
40
60
80
20
40
60
80
100 120 140 160
°C
190
T
C
T
C
3 Safe operating area
I
D
=
f
(
V
DS
)
parameter :
D
= 0 ,
T
C
= 25 °C
10
3
SPP80N04S2-04
4 Max. transient thermal impedance
Z
thJC
=
f
(t
p
)
parameter :
D
=
t
p
/T
K/W
10
1
SPP80N04S2-04
DS
/
I
D
A
V
t
p = 59.0µs
100 µs
10
0
Z
thJC
1 ms
I
D
R
10
2
DS
(o
n)
=
10
-1
10
-2
D = 0.50
0.20
0.10
0.05
0.02
10
1
10
-3
10
-4
single pulse
0.01
10
0 -1
10
10
0
10
1
V
10
2
10
-5 -7
10
10
-6
10
-5
10
-4
10
-3
10
-2
s
10
0
V
DS
Page 4
t
p
2004-05-24
SPI80N04S2-04
SPP80N04S2-04,SPB80N04S2-04
5 Typ. output characteristic
I
D
=
f
(V
DS
);
T
j
=25°C
parameter:
t
p
= 80 µs
190
SPP80N04S2-04
6 Typ. drain-source on resistance
R
DS(on)
=
f
(I
D
)
parameter:
V
GS
13
SPP80N04S2-04
A
160
140
P
tot
= 300W
g
f
V
GS [V]
a
4.5
b
5.0
5.3
5.5
5.7
6.0
10.0
mΩ
11
10
b
c
d
e
c
d
R
DS(on)
e
9
8
7
6
5
4
f
I
D
120
d
e
f
g
100
80
60
40
20
a
b
c
3
2
1
V
GS
[V] =
b
5.0
c
5.3
d
5.5
e
f
5.7 6.0
g
10.0
g
0
0
0.5
1
1.5
2
2.5
3
3.5
4
V
5
0
0
20
40
60
80
100
120
A
160
V
DS
I
D
7 Typ. transfer characteristics
I
D
=
f
(
V
GS
);
V
DS
≥
2 x
I
D
x
R
DS(on)max
parameter:
t
p
= 80 µs
320
8 Typ. forward transconductance
g
fs
= f(I
D
);
T
j
=25°C
parameter:
g
fs
160
A
S
240
120
200
g
fs
9
V
V
GS
I
D
100
160
80
120
60
80
40
40
20
0
0
1
2
3
4
5
6
7
0
0
20
40
60
80 100 120 140 160
A
200
I
D
Page 5
2004-05-24