SRAM Module, 512KX8, 20ns, CMOS, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Microsemi |
package instruction | 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
Reach Compliance Code | unknown |
Maximum access time | 20 ns |
Other features | USER CONFIGURABLE AS 128K X 32 |
Spare memory width | 16 |
JESD-30 code | S-CPGA-P66 |
length | 30.1 mm |
memory density | 4194304 bit |
Memory IC Type | SRAM MODULE |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 66 |
word count | 524288 words |
character code | 512000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 512KX8 |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | PGA |
Package shape | SQUARE |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum seat height | 6.22 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | PIN/PEG |
Terminal pitch | 2.54 mm |
Terminal location | PERPENDICULAR |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 30.1 mm |