WS128K32-20G1TM datasheet, PDF

WS128K32-20G1TM: DescriptionSRAM Module, 128KX32, 20ns, CMOS, CQFP68, 23.90 MM, 4.06 MM HEIGHT, CERAMIC, QFP-68; Categorystorage storage; File Size376KB，11 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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WS128K32-20G1TM Overview

SRAM Module, 128KX32, 20ns, CMOS, CQFP68, 23.90 MM, 4.06 MM HEIGHT, CERAMIC, QFP-68

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Microsemi
package instruction	23.90 MM, 4.06 MM HEIGHT, CERAMIC, QFP-68
Reach Compliance Code	unknown
Maximum access time	20 ns
Other features	USER CONFIGURABLE AS 512K X 8
Spare memory width	16
I/O type	COMMON
JESD-30 code	S-CQFP-G68
JESD-609 code	e4
length	23.88 mm
memory density	4194304 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of functions	1
Number of terminals	68
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	128KX32
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QFP
Encapsulate equivalent code	QFP68,.99SQ,50
Package shape	SQUARE
Package form	FLATPACK
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.06 mm
Maximum standby current	0.08 A
Minimum standby current	4.5 V
Maximum slew rate	0.6 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	GOLD
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	23.88 mm

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