MX25L4006EM1I-12G datasheet, PDF

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MX25L4006EM1I-12G: Description2M X 2 FLASH 2.7V PROM, PDSO8; Categorystorage storage; File Size1MB，53 Pages; ManufacturerMacronix; Websitehttp://www.macronix.com/en-us/Pages/default.aspx; Environmental Compliance

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MX25L4006EM1I-12G Overview

2M X 2 FLASH 2.7V PROM, PDSO8

MX25L4006EM1I-12G Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	SOIC
package instruction	SOP, SOP8,.25
Contacts	8
Reach Compliance Code	unknow
ECCN code	3A991.B.1.A
Factory Lead Time	2 weeks
Spare memory width	1
Maximum clock frequency (fCLK)	86 MHz
Data retention time - minimum	20
Durability	100000 Write/Erase Cycles
JESD-30 code	R-PDSO-G8
JESD-609 code	e3
length	4.9 mm
memory density	4194304 bi
Memory IC Type	FLASH
memory width	2
Number of functions	1
Number of terminals	8
word count	2097152 words
character code	2000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX2
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP8,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3/3.3 V
Programming voltage	2.7 V
Certification status	Not Qualified
Maximum seat height	1.75 mm
Serial bus type	SPI
Maximum standby current	0.00001 A
Maximum slew rate	0.02 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin (Sn)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
type	NOR TYPE
width	3.9 mm
write protect	HARDWARE/SOFTWARE
Base Number Matches	1

MX25L4006EM1I-12G Related Products

	MX25L4006EM1I-12G	MX25L4006EM2I-12G	MX25L4006EPI-12G	MX25L4006EZUI-12G	MX25L4006EZNI-12G
Description	2M X 2 FLASH 2.7V PROM, PDSO8	2M X 2 FLASH 2.7V PROM, PDSO8	2M X 2 FLASH 2.7V PROM, PDIP8	FLASH 2.7V PROM	2M X 2 FLASH 2.7V PROM, PDSO8
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to
package instruction	SOP, SOP8,.25	SOP, SOP8,.3	DIP, DIP8,.3	HVSON, SOLCC8,.12,20	HVSON, SOLCC8,.25
Reach Compliance Code	unknow	unknow	unknow	unknow	unknow
Spare memory width	1	1	1	1	1
Maximum clock frequency (fCLK)	86 MHz	86 MHz	86 MHz	86 MHz	86 MHz
Data retention time - minimum	20	20	20	20	20
Durability	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles
JESD-30 code	R-PDSO-G8	R-PDSO-G8	R-PDIP-T8	R-PDSO-N8	R-PDSO-N8
length	4.9 mm	5.28 mm	9.27 mm	3 mm	6 mm
memory density	4194304 bi	4194304 bi	4194304 bi	4194304 bi	4194304 bi
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	2	2	2	2	2
Number of functions	1	1	1	1	1
Number of terminals	8	8	8	8	8
word count	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words
character code	2000000	2000000	2000000	2000000	2000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	2MX2	2MX2	2MX2	2MX2	2MX2
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	SOP	DIP	HVSON	HVSON
Encapsulate equivalent code	SOP8,.25	SOP8,.3	DIP8,.3	SOLCC8,.12,20	SOLCC8,.25
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V
Programming voltage	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.75 mm	2.16 mm	5.33 mm	0.6 mm	0.8 mm
Serial bus type	SPI	SPI	SPI	SPI	SPI
Maximum standby current	0.00001 A	0.00001 A	0.00001 A	0.00001 A	0.00001 A
Maximum slew rate	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3 V	3.3 V
surface mount	YES	YES	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	GULL WING	THROUGH-HOLE	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	0.5 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	3.9 mm	5.23 mm	7.62 mm	2 mm	5 mm
write protect	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE
Parts packaging code	SOIC	SOIC	DIP	-	QFN
Contacts	8	8	8	-	8
ECCN code	3A991.B.1.A	EAR99	EAR99	-	EAR99
Factory Lead Time	2 weeks	16 weeks	-	16 weeks	16 weeks
Base Number Matches	1	1	-	1	1

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