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MPC8313VRGDFA

Description
32-BIT, 333 MHz, MICROPROCESSOR, PBGA516
Categorysemiconductor    The embedded processor and controller   
File Size1MB,100 Pages
ManufacturerFREESCALE (NXP)
Download Datasheet Parametric View All

MPC8313VRGDFA Overview

32-BIT, 333 MHz, MICROPROCESSOR, PBGA516

MPC8313VRGDFA Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals516
Maximum supply/operating voltage1.5 V
Minimum supply/operating voltage0.9500 V
Rated supply voltage1 V
External data bus width32
Line speed333 MHz
Processing package description27 × 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, 铅 FREE, TEPBGAII-516
Lead-freeYes
stateACTIVE
packaging shapeSQUARE
Package SizeGRID array, HEAT SINK/SLUG
surface mountYes
Terminal formBALL
Terminal spacing1 mm
terminal coatingNOT SPECIFIED
Terminal locationBOTTOM
Packaging MaterialsPlastic/Epoxy
Address bus width32
Number of digits32
boundary scanYes
Maximum FCLK clock frequency66.67 MHz
floating point unitYes
Integrated cacheYes
low power modeYes
Microprocessor typemicroprocessor
Freescale Semiconductor
Technical Data
Document Number: MPC8313EEC
Rev. 2.1, 12/2008
MPC8313E
PowerQUICC II Pro Processor
Hardware Specifications
This document provides an overview of the MPC8313E
PowerQUICC™ II Pro processor features, including a block
diagram showing the major functional components. The
MPC8313E is a cost-effective, low-power, highly integrated
host processor that addresses the requirements of several
printing and imaging, consumer, and industrial applications,
including main CPUs and I/O processors in printing systems,
networking switches and line cards, wireless LANs
(WLANs), network access servers (NAS), VPN routers,
intelligent NIC, and industrial controllers. The MPC8313E
extends the PowerQUICC™ family, adding higher CPU
performance, additional functionality, and faster interfaces
while addressing the requirements related to time-to-market,
price, power consumption, and package size.
NOTE
The information in this document is accurate for
revisions 1.0, 2.x, and later. See
Section 24.1, “Part
Numbers Fully Addressed by this Document.”
Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 6
Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 10
Clock Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 12
RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 13
DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . 14
DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Ethernet: Three-Speed Ethernet, MII Management . 21
High-Speed Serial Interfaces (HSSI) . . . . . . . . . . . . 36
USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Enhanced Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . 47
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
I
2
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
IPIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . 63
Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
System Design Information . . . . . . . . . . . . . . . . . . . 88
Document Revision History . . . . . . . . . . . . . . . . . . . 94
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 97
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© Freescale Semiconductor, Inc., 2007, 2008. All rights reserved.
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