HIS089-01GG datasheet, PDF - EEWORLD Datasheet

HIS089-01GG: DescriptionIC Socket, PGA89, 89 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder; CategoryThe connector socket; File Size2MB，27 Pages; ManufacturerAdvanced Interconnections Corp.; Environmental Compliance

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HIS089-01GG Overview

IC Socket, PGA89, 89 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Advanced Interconnections Corp.
Reach Compliance Code	compliant
ECCN code	EAR99
body width	1.2 inch
subject depth	0.165 inch
body length	1.2 inch
Contact structure	12X12
Contact to complete cooperation	AU ON NI
Contact completed and terminated	Gold (Au) - with Nickel (Ni) barrier
Contact material	BE-CU
Contact style	RND PIN-SKT
Device slot type	IC SOCKET
Type of equipment used	PGA89
Shell material	GLASS FILLED THERMOPLASTIC
JESD-609 code	e4
Manufacturer's serial number	HIS
Plug contact pitch	0.1 inch
Installation method	STRAIGHT
Number of contacts	89
Maximum operating temperature	150 °C
Minimum operating temperature	-60 °C
PCB contact pattern	RECTANGULAR
PCB contact row spacing	0.1 mm
Terminal pitch	2.54 mm
Termination type	SOLDER

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