High Power Resistors
HP03 Series
Construction
1. High purity alumina substrate
2. Protective covering
3. Resistive covering
4. Termination inner (Ag / Pd)
5. Termination (between) Ni plating
6. Termination (outer) Sn plating
Power Rating and Dimensions
Dimensions : Millimetres
Dimensions
Type
HP03
L
1.6 ±0.1
W
0.8 +0.15
-0.1
H
0.45 ±0.1
L1
0.3 ±0.2
L2
0.3 ±0.2
Dimensions : Millimetres
Power Rating
Type
HP03
Power Rating
at 70°C
(W)
0.125
Tolerance
%
±1
Resistance Range
Ω
(Ω)
1 to 10 M
Standard Series
E-96
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Page <1>
25/04/12 V1.1
High Power Resistors
HP06 Series
Power Rating
Resistors shall have a power rating based on continuous load operation at an ambient temperature of 70°C. For temperature in
excess of 70°C, the load shall be derated
Voltage Rating
Resistors shall have a rated direct-current (DC) continuous working voltage or an approximate sine-wave root-mean-square (RMS)
alternating-current (AC) continuous working voltage at commercial line frequency and waveform corresponding to the power rating, as
determined from the following formula :
RCWV =
√P
x R
Where : RCWV = Rated DC or RMS AC continuous working voltage at commercial-line frequency and waveform (volt)
P = Power rating (watt)
R = Nominal resistance (Ω)
In no case shall the rated DC or RMS AC continuous working voltage be greater than the applicable maximum value
Specification Table
Type
HP03
Power
Rating
(W)
0.125
Maximum
Working
Voltage (V)
50
Maximum
Overload Voltage
(V)
100
Dielectric
Withstanding
Voltage (V)
300
Temperature
Range
(°C)
-55 to +155
Ambient
Temperature
(°C)
70
Marking
A. Multiplier Code for Marking Reference
Code
Multiplier
A
10
0
B
10
1
C
10
2
D
10
3
E
10
4
F
10
5
G
10
6
H
10
7
X
10
-1
Y
10
-2
Z
10
-3
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Page <2>
25/04/12 V1.1
High Power Resistors
HP06 Series
Performance specification
Characteristics
Limits
Test Methods (JIS C 5201-1)
Natural resistance change per temperature degree
centigrade R2-R1 / R1 (t2-t1) × 10
6
(PPm / °C)
Temperature Coefficient
≤10
E : ±200 PPM / °C
>10 E : ±100 PPM / °C
R1 : Resistance value at room temperature (t1)
R2 : Resistance value at room temperature plus
100°C (t2)
Test pattern
: Room temperature (t1),
Room temperature +100°C (t2)
Short Time Overload
Resistance change rate is
±5% (2% + 0.1
Ω)
maximum
±1% (1% + 0.1
Ω)
maximum
± (1% + 0.05
Ω)
maximum
No evidence of flashover mechanical
damage, arcing or insulation break
down
Permanent resistance change after the application of a
potential of 2.5 times RCWV for 5 seconds
Twist of Test Board : Y/X = 3/90 mm for 60 seconds
Clamped in the trough of a 90°C metallic V-block and
shall be tested at AC potential respectively specified in
the type for 60 to 70 seconds
Test temperature of solder : 245 ±3°C; dipping time in
Solder
: 2 to 3 seconds
Terminal Bending
Dielectric Withstanding
Voltage
Solderability
Minimum 95% coverage
Soldering Heat
Resistance change rate is
±(1% + 0.05
Ω)
maximum
Dip the resistor into a solder bath having a temperature
of 260°C ±3°C and hold It for 10 ±1 seconds
Resistance change after continuous 5 cycles for duty
cycle specified below:
Temperature Cycling
±5% (1% + 0.05
Ω)
maximum
±1% (0.5% + 0.05
Ω)
maximum
Step
1
2
3
4
Temperature
-55°C ±3°C
Room temperature
+155°C ±2°C
Room temperature
Time
30 minutes
10 to 15 minutes
30 minutes
10 to 15 minutes
Load Life in Humidity
Resistance change rate is
±5% (3% + 0.1
Ω)
maximum
±1% (1% + 0.1
Ω)
maximum
Resistance change rate is
±5% (3% + 0.1
Ω)
maximum
±1% (1% + 0.1
Ω)
maximum
Resistance change after 1,000 hours (1.5 hours "on",
0.5 hour "off") at RCWV in a humidity chamber
controlled at 40°C ±2°C and 90 to 95% relative humidity
Permanent resistance change after 1,000 hours
operating at RCWV with duty cycle of (1.5 hours "on",
0.5 hour "off") at 70°C ±2°C ambient
Load Life
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Page <4>
25/04/12 V1.1
PCB Design
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