22202C333MAT7A datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Passive components> capacitor> 22202C333MAT7A

22202C333MAT7A: DescriptionCeramic Capacitor, Multilayer, Ceramic, 200V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.033uF, Surface Mount, 2220, CHIP; CategoryPassive components capacitor; File Size77KB，4 Pages; ManufacturerAVX; Environmental Compliance

Download Datasheet Parametric View All

22202C333MAT7A Overview

Ceramic Capacitor, Multilayer, Ceramic, 200V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.033uF, Surface Mount, 2220, CHIP

22202C333MAT7A Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	AVX
package instruction	, 2220
Reach Compliance Code	compliant
ECCN code	EAR99
capacitance	0.033 µF
Capacitor type	CERAMIC CAPACITOR
Custom functions	Non-Specified Cap Value On Request
dielectric materials	CERAMIC
high	2.29 mm
JESD-609 code	e3
length	5.7 mm
Manufacturer's serial number	2220
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	20%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	SMT
method of packing	BULK CASSETTE
positive tolerance	20%
Rated (DC) voltage (URdc)	200 V
series	2220(200 V)
size code	2220
surface mount	YES
Temperature characteristic code	X7R
Temperature Coefficient	15% ppm/°C
Terminal surface	Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal shape	WRAPAROUND
width	5 mm

22202C333MAT7A Preview

X7R Dielectric

General Specifications

X7R formulations are called “temperature stable” ceramics

and fall into EIA Class II materials. X7R is the most popular of

these intermediate dielectric constant materials. Its tempera-

ture variation of capacitance is within ±15% from

-55°C to +125°C. This capacitance change is non-linear.

Capacitance for X7R varies under the influence of electrical

operating conditions such as voltage and frequency.

X7R dielectric chip usage covers the broad spectrum of

industrial applications where known changes in capacitance

due to applied voltages are acceptable.

PART NUMBER (see page 2 for complete part number explanation)

0805

Size

(L" x W")

Voltage

4V = 4

6.3V = 6

10V = Z

16V = Y

25V = 3

50V = 5

100V = 1

200V = 2

500V = 7

Dielectric

X7R = C

103

Capacitance

Code (In pF)

2 Sig. Digits +

Number of Zeros

Capacitance

Tolerance

J = ± 5%*

K = ±10%

M = ± 20%

*≤1µF only

Failure

Rate

A = Not

Applicable

Terminations

T = Plated Ni

and Sn

7 = Gold Plated*

Z= FLEXITERM

Packaging

2 = 7" Reel

4 = 13" Reel

7 = Bulk Cass.

9 = Bulk

Special

Code

A = Std. Product

*Optional termination

**See FLEXITERM

X7R section

Contact

Factory For

Multiples

NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.

Contact factory for non-specified capacitance values.

Insulation Resistance (Ohm-Farads)

X7R Dielectric

Typical Temperature Coefficient

Capacitance vs. Frequency

+30

+20

Insulation Resistance vs Temperature

10,000

Capacitance

% Cap Change

-5

-10

-15

-20

-25

-60 -40 -20

80 100 120 140

+10

-10

-20

-30

1KHz

1,000

100

10 KHz

100 KHz

1 MHz

10 MHz

100

120

Temperature

°C

Frequency

Temperature

°C

Variation of Impedance with Cap Value

Impedance vs. Frequency

1,000 pF vs. 10,000 pF - X7R

0805

10.00

1,000 pF

10,000 pF

Variation of Impedance with Chip Size

Impedance vs. Frequency

10,000 pF - X7R

1206

0805

1210

Variation of Impedance with Chip Size

Impedance vs. Frequency

100,000 pF - X7R

1206

0805

1210

Impedance,

1.00

1.0

Impedance,

1.0

0.10

0.1

0.01

100

1000

.01

100

1,000

100

1,000

Frequency, MHz

X7R Dielectric

Specifications and Test Methods

Parameter/Test

Operating Temperature Range

Capacitance

Dissipation Factor

X7R Specification Limits

-55ºC to +125ºC

Within specified tolerance

≤

2.5% for

≥

50V DC rating

≤

3.0% for 25V DC rating

≤

3.5% for 16V DC rating

≤

5.0% for

≤

10V DC rating

100,000MΩ or 1000MΩ - µF,

whichever is less

No breakdown or visual defects

Measuring Conditions

Temperature Cycle Chamber

Freq.: 1.0 kHz ± 10%

Voltage: 1.0Vrms ± .2V

For Cap > 10 µF, 0.5Vrms @ 120Hz

Charge device with rated voltage for

120 ± 5 secs @ room temp/humidity

Charge device with 300% of rated voltage for

1-5 seconds, w/charge and discharge current

limited to 50 mA (max)

Note: Charge device with 150% of rated

voltage for 500V devices.

Deflection: 2mm

Test Time: 30 seconds

1mm/sec

Insulation Resistance

Dielectric Strength

Resistance to

Flexure

Stresses

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

No defects

≤

±12%

Meets Initial Values (As Above)

≥

Initial Value x 0.3

≥

95% of each terminal should be covered

with fresh solder

No defects, <25% leaching of either end terminal

≤

±7.5%

Meets Initial Values (As Above)

No visual defects

≤

±7.5%

Meets Initial Values (As Above)

No visual defects

≤

±12.5%

≤

Initial Value x 2.0 (See Above)

≥

Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

No visual defects

≤

±12.5%

≤

Initial Value x 2.0 (See Above)

≥

Initial Value x 0.3 (See Above)

Meets Initial Values (As Above)

90 mm

Solderability

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Appearance

Capacitance

Variation

Dissipation

Factor

Insulation

Resistance

Dielectric

Strength

Dip device in eutectic solder at 230 ± 5ºC

for 5.0 ± 0.5 seconds

Resistance to

Solder Heat

Dip device in eutectic solder at 260ºC for 60

seconds. Store at room temperature for 24 ± 2

hours before measuring electrical properties.

Step 1: -55ºC ± 2º

Step 2: Room Temp

Step 3: +125ºC ± 2º

Step 4: Room Temp

30 ± 3 minutes

≤

3 minutes

30 ± 3 minutes

≤

3 minutes

Thermal

Shock

Repeat for 5 cycles and measure after

24 ± 2 hours at room temperature

Charge device with 1.5 rated voltage (≤ 10V) in

test chamber set at 125ºC ± 2ºC

for 1000 hours (+48, -0)

Remove from test chamber and stabilize

at room temperature for 24 ± 2 hours

before measuring.

Store in a test chamber set at 85ºC ± 2ºC/

85% ± 5% relative humidity for 1000 hours

(+48, -0) with rated voltage applied.

Remove from chamber and stabilize at

room temperature and humidity for

24 ± 2 hours before measuring.

Load Life

Load

Humidity

X7R Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

Soldering

Packaging

(L) Length

(W) Width

(t)

Terminal

Cap

(pF)

(in.)

WVDC

100

150

220

330

470

680

1000

1500

2200

3300

4700

6800

0.010

0.015

0.022

0.033

0.047

0.068

0.10

0.15

0.22

0.33

0.47

0.68

1.0

1.5

2.2

3.3

4.7

100

WVDC

0201

Reflow Only

All Paper

0.60 ± 0.03

(0.024 ± 0.001)

0.30 ± 0.03

(0.011 ± 0.001)

0.15 ± 0.05

(0.006 ± 0.002)

0402

Reflow Only

All Paper

1.00 ± 0.10

(0.040 ± 0.004)

0.50 ± 0.10

(0.020 ± 0.004)

0.25 ± 0.15

(0.010 ± 0.006)

0603

Reflow Only

All Paper

1.60 ± 0.15

(0.063 ± 0.006)

0.81 ± 0.15

(0.032 ± 0.006)

0.35 ± 0.15

(0.014 ± 0.006)

0805

Reflow/Wave

Paper/Embossed

2.01 ± 0.20

(0.079 ± 0.008)

1.25 ± 0.20

(0.049 ± 0.008)

0.50 ± 0.25

(0.020 ± 0.010)

1206

Reflow/Wave

Paper/Embossed

3.20 ± 0.20

(0.126 ± 0.008)

1.60 ± 0.20

(0.063 ± 0.008)

0.50 ± 0.25

(0.020 ± 0.010)

50 100

6.3

100

200

6.3

100

200

6.3

200

500

Cap

(µF

6.3

100

200

6.3

100

200

6.3

100

200

500

SIZE

Letter

Max.

Thickness

0.33

(0.013)

0201

0.56

(0.022)

0402

0.71

(0.028)

PAPER

0.90

(0.035)

0.94

(0.037)

0603

1.02

(0.040)

1.27

(0.050)

1.40

(0.055)

0805

1.52

1.78

(0.060)

(0.070)

EMBOSSED

2.29

(0.090)

2.54

(0.100)

1206

2.79

(0.110)

= Under Development

X7R Dielectric

Capacitance Range

PREFERRED SIZES ARE SHADED

SIZE

Soldering

Packaging

(L) Length

(W) Width

(t) Terminal

Cap

(pF)

(in.)

WVDC

100

150

220

330

470

680

1000

1500

2200

3300

4700

6800

0.010

0.015

0.022

0.033

0.047

0.068

0.10

0.15

0.22

0.33

0.47

0.68

1.0

1.5

2.2

3.3

4.7

100

WVDC

1210

Reflow Only

Paper/Embossed

3.20 ± 0.20

(0.126 ± 0.008)

2.50 ± 0.20

(0.098 ± 0.008)

0.50 ± 0.25

(0.020 ± 0.010)

100

1812

Reflow Only

All Embossed

4.50 ± 0.30

(0.177 ± 0.012)

3.20 ± 0.20

(0.126 ± 0.008)

0.61 ± 0.36

(0.024 ± 0.014)

100

200

1825

Reflow Only

All Embossed

4.50 ± 0.30

(0.177 ± 0.012)

6.40 ± 0.40

(0.252 ± 0.016)

0.61 ± 0.36

(0.024 ± 0.014)

100

2220

Reflow Only

All Embossed

5.70 ± 0.40

(0.225 ± 0.016)

5.00 ± 0.40

(0.197 ± 0.016)

0.64 ± 0.39

(0.025 ± 0.015)

100

2225

Reflow Only

All Embossed

5.72 ± 0.25

(0.225 ± 0.010)

6.35 ± 0.25

(0.250 ± 0.010)

0.64 ± 0.39

(0.025 ± 0.015)

100

200

500

200

Cap

(µF

100

200

500

100

200

500

100

200

100

SIZE

Letter

Max.

Thickness

0.33

(0.013)

0.56

(0.022)

0.71

(0.028)

PAPER

1210

0.90

(0.035)

0.94

(0.037)

1.02

(0.040)

1.27

(0.050)

1812

1.40

(0.055)

1825

1.52

1.78

(0.060)

(0.070)

EMBOSSED

2.29

(0.090)

2220

2.54

(0.100)

2.79

(0.110)

2225

= Under Development

More (Only the first 5 pages are displayed. Please Download Datasheet to view the full content.) >

Recommended Resources

Dual-purpose voice-activated light switch circuit

LED tuning indication circuit

Sensitive long range digital thermometer

High precision and high stability 10V regulated power supply

Computer motherboard circuit diagram 440LX2_31

Electric water heater circuit diagram 03

How are the low drive capability and high drive capability of the pin drive capability register PDDR realized?: How are the low drive capability and high drive capability of the pin drive capability register PDDR realized? Is this mode a push-pull output mode?...; 一沙一世 stm32/stm8

[Mill Edge AI Computing Box FZ5 Review] First experience with "image recognition": Mir Edge AI Computing Box FZ5 Unboxing Experience:After checking the contents of the box and the packing list, I found the following in the photo. (The TF card is 32G and is inserted into the host.) A...; bigbat Embedded System

Three practical tips for optimizing EVM measurements of wideband signals: Error vector magnitude (EVM) measurements can help engineers gain insight into the performance of digital communication transmitters and receivers. For digitally modulated signals, any signal imperfec...; eric_wang Integrated technical exchanges

EnDat 2.2 Absolute Encoder Master Interface Reference Design for C2000 MCUs: TIDM-1008 is an EnDat 2.2 absolute encoder master interface reference design for C2000 MCUs. C2000 Position Manager technology provides an integrated solution to connect digital absolute encoders as w...; Jacktang Microcontroller MCU

10 PCB heat dissipation methods, understand them in one article!: For electronic devices, a certain amount of heat will be generated when working, causing the internal temperature of the device to rise rapidly. If the heat is not dissipated in time, the device will ...; 造物工场kbidm PCB Design

STC15 series gpio problem: I didn't use the template function for GPIO, I just wrote it like thisAnd then... Please tell me the correct operation posture....; grove_armweak MCU

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components