M58LT128GSB1ZA5E datasheet, PDF

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M58LT128GSB1ZA5E: Description128Mbit (8Mb x16, Multiple Bank, Multi-Level, Burst) 1.8V Supply Secure Flash Memories; Categorystorage storage; File Size503KB，98 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

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M58LT128GSB1ZA5E Overview

128Mbit (8Mb x16, Multiple Bank, Multi-Level, Burst) 1.8V Supply Secure Flash Memories

M58LT128GSB1ZA5E Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	STMicroelectronics
Parts packaging code	BGA
package instruction	10 X 13 MM, 1 MM PITCH, LEAD FREE, TBGA-64
Contacts	64
Reach Compliance Code	compli
ECCN code	3A991.B.1.A
Maximum access time	110 ns
Other features	ALSO OPERATES IN SYNC-REGISTERED MODE
startup block	BOTTOM
command user interface	YES
Universal Flash Interface	YES
Data polling	NO
JESD-30 code	R-PBGA-B64
length	13 mm
memory density	134217728 bi
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of departments/size	4,127
Number of terminals	64
word count	8388608 words
character code	8000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	8MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TBGA
Encapsulate equivalent code	BGA64,8X8,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE
page size	8 words
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	1.8,3/3.3 V
Programming voltage	1.8 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Department size	16K,64K
Maximum standby current	0.000005 A
Maximum slew rate	0.047 mA
Maximum supply voltage (Vsup)	2 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
switch bit	NO
type	NOR TYPE
width	10 mm

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Is it Rohs certified?	conform to	-	-	conform to	-	incompatible	conform to	conform to
Maker	STMicroelectronics	-	-	STMicroelectronics	-	STMicroelectronics	STMicroelectronics	STMicroelectronics
Parts packaging code	BGA	-	-	BGA	-	BGA	BGA	BGA
package instruction	10 X 13 MM, 1 MM PITCH, LEAD FREE, TBGA-64	-	-	10 X 13 MM, 1 MM PITCH, LEAD FREE, TBGA-64	-	10 X 13 MM, 1 MM PITCH, TBGA-64	10 X 13 MM, 1 MM PITCH, LEAD FREE, TBGA-64	10 X 13 MM, 1 MM PITCH, LEAD FREE, TBGA-64
Contacts	64	-	-	64	-	64	64	64
Reach Compliance Code	compli	-	-	compli	-	_compli	compli	compli
ECCN code	3A991.B.1.A	-	-	3A991.B.1.A	-	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A
Maximum access time	110 ns	-	-	110 ns	-	110 ns	110 ns	110 ns
Other features	ALSO OPERATES IN SYNC-REGISTERED MODE	-	-	ALSO OPERATES IN SYNC-REGISTERED MODE	-	ALSO OPERATES IN SYNC-REGISTERED MODE	ALSO OPERATES IN SYNC-REGISTERED MODE	ALSO OPERATES IN SYNC-REGISTERED MODE
startup block	BOTTOM	-	-	BOTTOM	-	TOP	TOP	TOP
command user interface	YES	-	-	YES	-	YES	YES	YES
Universal Flash Interface	YES	-	-	YES	-	YES	YES	YES
Data polling	NO	-	-	NO	-	NO	NO	NO
JESD-30 code	R-PBGA-B64	-	-	R-PBGA-B64	-	R-PBGA-B64	R-PBGA-B64	R-PBGA-B64
length	13 mm	-	-	13 mm	-	13 mm	13 mm	13 mm
memory density	134217728 bi	-	-	134217728 bi	-	134217728 bi	134217728 bi	134217728 bi
Memory IC Type	FLASH	-	-	FLASH	-	FLASH	FLASH	FLASH
memory width	16	-	-	16	-	16	16	16
Number of functions	1	-	-	1	-	1	1	1
Number of departments/size	4,127	-	-	4,127	-	4,127	4,127	4,127
Number of terminals	64	-	-	64	-	64	64	64
word count	8388608 words	-	-	8388608 words	-	8388608 words	8388608 words	8388608 words
character code	8000000	-	-	8000000	-	8000000	8000000	8000000
Operating mode	ASYNCHRONOUS	-	-	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	-	-	85 °C	-	85 °C	85 °C	85 °C
Minimum operating temperature	-25 °C	-	-	-25 °C	-	-25 °C	-25 °C	-25 °C
organize	8MX16	-	-	8MX16	-	8MX16	8MX16	8MX16
Package body material	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TBGA	-	-	TBGA	-	TBGA	TBGA	TBGA
Encapsulate equivalent code	BGA64,8X8,40	-	-	BGA64,8X8,40	-	BGA64,8X8,40	BGA64,8X8,40	BGA64,8X8,40
Package shape	RECTANGULAR	-	-	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE	-	-	GRID ARRAY, THIN PROFILE	-	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE
page size	8 words	-	-	8 words	-	8 words	8 words	8 words
Parallel/Serial	PARALLEL	-	-	PARALLEL	-	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	260	-	-	260	-	240	260	260
power supply	1.8,3/3.3 V	-	-	1.8,3/3.3 V	-	1.8,3/3.3 V	1.8,3/3.3 V	1.8,3/3.3 V
Programming voltage	1.8 V	-	-	1.8 V	-	1.8 V	1.8 V	1.8 V
Certification status	Not Qualified	-	-	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	-	-	1.2 mm	-	1.2 mm	1.2 mm	1.2 mm
Department size	16K,64K	-	-	16K,64K	-	16K,64K	16K,64K	16K,64K
Maximum standby current	0.000005 A	-	-	0.000005 A	-	0.000005 A	0.000005 A	0.000005 A
Maximum slew rate	0.047 mA	-	-	0.047 mA	-	0.047 mA	0.047 mA	0.047 mA
Maximum supply voltage (Vsup)	2 V	-	-	2 V	-	2 V	2 V	2 V
Minimum supply voltage (Vsup)	1.7 V	-	-	1.7 V	-	1.7 V	1.7 V	1.7 V
Nominal supply voltage (Vsup)	1.8 V	-	-	1.8 V	-	1.8 V	1.8 V	1.8 V
surface mount	YES	-	-	YES	-	YES	YES	YES
technology	CMOS	-	-	CMOS	-	CMOS	CMOS	CMOS
Temperature level	OTHER	-	-	OTHER	-	OTHER	OTHER	OTHER
Terminal form	BALL	-	-	BALL	-	BALL	BALL	BALL
Terminal pitch	1 mm	-	-	1 mm	-	1 mm	1 mm	1 mm
Terminal location	BOTTOM	-	-	BOTTOM	-	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	40	-	-	40	-	30	40	40
switch bit	NO	-	-	NO	-	NO	NO	NO
type	NOR TYPE	-	-	NOR TYPE	-	NOR TYPE	NOR TYPE	NOR TYPE
width	10 mm	-	-	10 mm	-	10 mm	10 mm	10 mm

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