M1AFS250M1AFS600-2FG256YI datasheet, PDF

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M1AFS250M1AFS600-2FG256YI: DescriptionIC,FPGA,13824-CELL,CMOS,BGA,256PIN,PLASTIC; Categorysemiconductor Programmable logic devices; File Size18MB，334 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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M1AFS250M1AFS600-2FG256YI Overview

IC,FPGA,13824-CELL,CMOS,BGA,256PIN,PLASTIC

M1AFS250M1AFS600-2FG256YI Parametric

Parameter Name	Attribute value
Number of terminals	256
Minimum operating temperature	-40 Cel
Maximum operating temperature	100 Cel
state	Active
Programmable logic type	FIELD PROGRAMMABLE GATE ARRAY
clock_frequency_max	350 MHz
jesd_30_code	S-PBGA-B256
Number of inputs	119
umber_of_logic_cells	13824
Number of outputs	119
Packaging Materials	PLASTIC/EPOXY
ckage_code	BGA
ckage_equivalence_code	BGA256,16X16,40
packaging shape	SQUARE
Package Size	GRID ARRAY
wer_supplies	1.5,3.3
qualification_status	COMMERCIAL
sub_category	Field Programmable Gate Arrays
surface mount	YES
Craftsmanship	CMOS
Temperature level	Industrial
Terminal form	BALL
Terminal spacing	1 mm
Terminal location	BOTTOM

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Revision 4

Fusion Family of Mixed Signal FPGAs

Features and Benefits

High-Performance Reprogrammable Flash Technology

•

Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process

Nonvolatile, Retains Program when Powered Off

Instant On Single-Chip Solution

350 MHz System Performance

In-System Programming (ISP) and Security

• ISP with 128-Bit AES via JTAG

• FlashLock

Designed to Protect FPGA Contents

Advanced Digital I/O

• 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

• Bank-Selectable I/O Voltages – Up to 5 Banks per Chip

• Single-Ended I/O Standards: LVTTL, LVCMOS

3.3 V / 2.5 V /1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X, and

LVCMOS 2.5 V / 5.0 V Input

• Differential I/O Standards: LVPECL, LVDS, B-LVDS, M-LVDS

– Built-In I/O Registers

– 700 Mbps DDR Operation

• Hot-Swappable I/Os

• Programmable Output Slew Rate, Drive Strength, and Weak

Pull-Up/Down Resistor

• Pin-Compatible Packages across the Fusion

Family

Embedded Flash Memory

• User Flash Memory – 2 Mbits to 8 Mbits

– Configurable 8-, 16-, or 32-Bit Datapath

– 10 ns Access in Read-Ahead Mode

• 1 Kbit of Additional FlashROM

Integrated A/D Converter (ADC) and Analog I/O

Up to 12-Bit Resolution and up to 600 Ksps

Internal 2.56 V or External Reference Voltage

ADC: Up to 30 Scalable Analog Input Channels

High-Voltage Input Tolerance: –10.5 V to +12 V

Current Monitor and Temperature Monitor Blocks

Up to 10 MOSFET Gate Driver Outputs

– P- and N-Channel Power MOSFET Support

– Programmable 1, 3, 10, 30 µA, and 20 mA Drive Strengths

• ADC Accuracy is Better than 1%

•

SRAMs and FIFOs

• Variable-Aspect-Ratio 4,608-Bit SRAM Blocks (×1, ×2, ×4, ×9,

and ×18 organizations available)

• True Dual-Port SRAM (except ×18)

• Programmable Embedded FIFO Control Logic

On-Chip Clocking Support

•

Internal 100 MHz RC Oscillator (accurate to 1%)

Crystal Oscillator Support (32 KHz to 20 MHz)

Programmable Real-Time Counter (RTC)

6 Clock Conditioning Circuits (CCCs) with 1 or 2 Integrated PLLs

– Phase Shift, Multiply/Divide, and Delay Capabilities

– Frequency: Input 1.5–350 MHz, Output 0.75–350 MHz

Soft ARM Cortex-M1 Fusion Devices (M1)

• ARM

Cortex-™M1–Enabled

Pigeon Point ATCA IP Support (P1)

• Targeted to Pigeon Point

Board Management Reference

(BMR) Starter Kits

• Designed in Partnership with Pigeon Point Systems

• ARM Cortex-M1 Enabled

• Targeted to Advanced Mezzanine Card (AdvancedMC™ Designs)

• Designed in Partnership with MicroBlade

• 8051-Based Module Management Controller (MMC)

Low Power Consumption

• Single 3.3 V Power Supply with On-Chip 1.5 V Regulator

• Sleep and Standby Low-Power Modes

MicroBlade Advanced Mezzanine Card Support (U1)

Table 1 • Fusion Family

Fusion Devices

ARM Cortex-M1

Devices

Pigeon Point Devices

MicroBlade Devices

System Gates

General

Information

Tiles (D-flip-flops)

Secure (AES) ISP

PLLs

Globals

Flash Memory Blocks (2 Mbits)

Total Flash Memory Bits

Memory

FlashROM Bits

RAM Blocks (4,608 bits)

RAM kbits

Analog Quads

Analog Input Channels

Analog and I/Os

Gate Driver Outputs

I/O Banks (+ JTAG)

Maximum Digital I/Os

Analog I/Os

90,000

2,304

Yes

1,024

U1AFS250

250,000

6,144

Yes

1,024

114

AFS090

AFS250

M1AFS250

AFS600

M1AFS600

P1AFS600

U1AFS600

600,000

13,824

Yes

1,024

108

172

AFS1500

M1AFS1500

P1AFS1500

U1AFS1500

1,500,000

38,400

Yes

1,024

270

252

Note:

*Refer to the

Cortex-M1

product brief for more information.

January 2013

Fusion Family of Mixed Signal FPGAs

Table of Contents

Fusion Device Family Overview

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

Unprecedented Integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4

Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10

Device Architecture

Fusion Stack Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

Core Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2

Clocking Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-19

Real-Time Counter System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-33

Embedded Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-41

Analog Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-79

Analog Configuration MUX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-129

User I/Os . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-135

Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-226

Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-231

DC and Power Characteristics

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

Calculating Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10

Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-32

Package Pin Assignments

QN108

QN180

PQ208

FG256

FG484

FG676

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-11

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-19

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-27

Datasheet Information

List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1

Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-17

Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-17

Revision 4

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