LVMDM Series LVC Low Voltage Logic Buffered 5-Tap Delay SMD Modules
Parameter Name | Attribute value |
Maker | Rhombus Industries, Inc. |
Parts packaging code | DIP |
package instruction | DIP, |
Contacts | 8 |
Reach Compliance Code | unknow |
series | LVC/LCX/Z |
JESD-30 code | R-PDIP-T8 |
Logic integrated circuit type | ACTIVE DELAY LINE |
Number of functions | 1 |
Number of taps/steps | 5 |
Number of terminals | 8 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Output polarity | TRUE |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
programmable delay line | NO |
Certification status | Not Qualified |
Maximum seat height | 6.35 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Total delay nominal (td) | 100 ns |
width | 7.62 mm |
LVMDM-100 | LVMDM-11G | LVMDM-75 | LVMDM-75G | LVMDM-7J | LVMDM-75J | |
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Description | LVMDM Series LVC Low Voltage Logic Buffered 5-Tap Delay SMD Modules | LVMDM Series LVC Low Voltage Logic Buffered 5-Tap Delay SMD Modules | LVMDM Series LVC Low Voltage Logic Buffered 5-Tap Delay SMD Modules | LVMDM Series LVC Low Voltage Logic Buffered 5-Tap Delay SMD Modules | LVMDM Series LVC Low Voltage Logic Buffered 5-Tap Delay SMD Modules | LVMDM Series LVC Low Voltage Logic Buffered 5-Tap Delay SMD Modules |
Maker | Rhombus Industries, Inc. | Rhombus Industries, Inc. | Rhombus Industries, Inc. | Rhombus Industries, Inc. | Rhombus Industries, Inc. | Rhombus Industries, Inc. |
Parts packaging code | DIP | SOIC | DIP | SOIC | SOIC | SOIC |
package instruction | DIP, | LOW PROFILE, SMD-8 | PLASTIC, DIP-8 | LOW PROFILE, SMD-8 | SOJ, | SOJ, |
Contacts | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow |
series | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
JESD-30 code | R-PDIP-T8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-J8 | R-PDSO-J8 |
Logic integrated circuit type | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
Number of taps/steps | 5 | 5 | 5 | 5 | 5 | 5 |
Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
Output polarity | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | SOP | DIP | SOP | SOJ | SOJ |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
programmable delay line | NO | NO | NO | NO | NO | NO |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 6.35 mm | 6.35 mm | 6.35 mm | 6.35 mm | 6.73 mm | 6.73 mm |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | NO | YES | NO | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | J BEND | J BEND |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Total delay nominal (td) | 100 ns | 11 ns | 75 ns | 75 ns | 7 ns | 75 ns |