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ST40RA200XH6

Description
32-bit Embedded SuperH Device
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size770KB,94 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Download Datasheet Parametric Compare View All

ST40RA200XH6 Overview

32-bit Embedded SuperH Device

ST40RA200XH6 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSTMicroelectronics
Parts packaging codeBGA
package instruction27 X 27 MM, 2.33 MM HEIGHT, PLASTIC, BGA-372
Contacts372
Reach Compliance Code_compli
ECCN code3A991.A.2
Other featuresALSO REQUIRES 3.3V SUPPLY
Address bus width32
bit size32
boundary scanYES
maximum clock frequency27 MHz
External data bus width32
FormatFLOATING POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B372
JESD-609 codee0
length27 mm
low power modeYES
Number of terminals372
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA372,20X20,50
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply1.8,3.3 V
Certification statusNot Qualified
Maximum seat height2.6 mm
speed200 MHz
Maximum supply voltage1.95 V
Minimum supply voltage1.8 V
Nominal supply voltage1.87 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width27 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
ST40RA
32-bit Embedded SuperH Device
DATASHEET
Integer & FP
execution units
JTAG
JTAG
Debug
UDI
SCIF
SCIF
Timer (TMU)
Real-time clock
Interrupt ctrl
SuperHyway
Clock ctrl
Flash
PLLs
PCI I/F 66MHz
ST40 Local Memory I/F
Cbus Bridge/
SuperHyway I/F
5 channel
DMA
controller
2 channel
control
MPX
Coprocessor
EMI
32 data
MMU
I Cache
MMU
D Cache
PIO
interface
Registers
Mailbox
24 data
32 data
PCI Peripherals
64 data
SDRAM
Peripherals
Overview
The ST40RA is the first member of the ST40 family. Based
on the SH-4, SuperH CPU core from SuperH Inc, the
ST40RA is designed to work as a standalone device, or as
part of a two chip solution for application specific systems.
Example applications the ST40RA is designed for include
digital consumer, embedded communications, industrial
and automotive. The high connectivity of the ST40 through
its PCI bus and its dual memory uses makes it a versatile
device, ideal for data-intensive and high performance
applications.
s
Memory protection and VM system support
q
q
64-entry unified TLB, 4-entry instruction TLB
4 Gbytes address space
s
Standard ST40 peripherals
q
q
2 synchronous serial ports with FIFO (SCIF)
Timers and a real-time clock
IO devices
q
q
Mailbox register for interprocessor communication
Additional PIO
System features
s
32-bit SuperH CPU
q
q
q
q
q
Bus interfaces
s
Local memory interface SDRAM & DDR SDRAM
q
64-bit hardware FPU (1.16 GFLOPS)
128-bit vector unit for matrix manipulations
166 MHz, 300 MIPS (DMIPS 1.1)
Up to 664 Mbytes/s CPU bandwidth
Direct mapped, on-chip, ICache (8 Kbytes) and DCache
(16 Kbytes)
Up to 100 MHz (1.6 Gbytes/s peak throughput)
s
PCI interface - 32-bit, 66/33 MHz, 3.3 V
s
Enhanced memory interface (EMI)
q
q
q
q
q
s
High-performance 5-channel DMA engine,
supporting 1D or 2D block moves and linked lists
s
SuperHyway internal interconnect
q
32-bit bus, up to 83 MHz, for attaching peripherals
High-speed, sync mode, burst flash ROM support
SDRAM support
MPX initiator and target interface
Programmable MPX bus arbiter
High throughput, low latency, split transaction packet
router
13 August 2003
ADCS 7260755H
STMicroelectronics
1/94

ST40RA200XH6 Related Products

ST40RA200XH6 ST40RA166XH6 ST40RA166XH1 ST40RA150XHA ST40RA
Description 32-bit Embedded SuperH Device 32-bit Embedded SuperH Device 32-bit Embedded SuperH Device 32-bit Embedded SuperH Device 32-bit Embedded SuperH Device
Is it lead-free? Contains lead Contains lead Contains lead Contains lead -
Is it Rohs certified? incompatible conform to conform to incompatible -
Parts packaging code BGA BGA BGA BGA -
package instruction 27 X 27 MM, 2.33 MM HEIGHT, PLASTIC, BGA-372 27 X 27 MM, 2.33 MM HEIGHT, PLASTIC, BGA-372 27 X 27 MM, 2.33 MM HEIGHT, PLASTIC, BGA-372 27 X 27 MM, 2.33 MM HEIGHT, PLASTIC, BGA-372 -
Contacts 372 372 372 372 -
Reach Compliance Code _compli compli compli _compli -
ECCN code 3A991.A.2 3A991.A.2 3A991.A.2 3A991.A.2 -
Other features ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY -
Address bus width 32 32 32 32 -
bit size 32 32 32 32 -
boundary scan YES YES YES YES -
maximum clock frequency 27 MHz 27 MHz 27 MHz 27 MHz -
External data bus width 32 32 32 32 -
Format FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT -
Integrated cache YES YES YES YES -
JESD-30 code S-PBGA-B372 S-PBGA-B372 S-PBGA-B372 S-PBGA-B372 -
JESD-609 code e0 e0 e0 e0 -
length 27 mm 27 mm 27 mm 27 mm -
low power mode YES YES YES YES -
Number of terminals 372 372 372 372 -
Maximum operating temperature 85 °C 85 °C 70 °C 85 °C -
Minimum operating temperature -40 °C -40 °C - -40 °C -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code BGA BGA BGA BGA -
Encapsulate equivalent code BGA372,20X20,50 BGA372,20X20,50 BGA372,20X20,50 BGA372,20X20,50 -
Package shape SQUARE SQUARE SQUARE SQUARE -
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY -
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
power supply 1.8,3.3 V 1.8,3.3 V 1.8,3.3 V 1.8,3.3 V -
Certification status Not Qualified Not Qualified Not Qualified Not Qualified -
Maximum seat height 2.6 mm 2.6 mm 2.6 mm 2.6 mm -
speed 200 MHz 166 MHz 166 MHz 150 MHz -
Maximum supply voltage 1.95 V 1.95 V 1.95 V 1.95 V -
Minimum supply voltage 1.8 V 1.65 V 1.65 V 1.65 V -
Nominal supply voltage 1.87 V 1.8 V 1.8 V 1.8 V -
surface mount YES YES YES YES -
technology CMOS CMOS CMOS CMOS -
Temperature level INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL -
Terminal surface Tin/Lead (Sn/Pb) TIN LEAD TIN LEAD Tin/Lead (Sn/Pb) -
Terminal form BALL BALL BALL BALL -
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm -
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM -
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
width 27 mm 27 mm 27 mm 27 mm -
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC -

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